Used SMT Equipment: thickness measurement (Page 1 of 2)

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

Used SMT Equipment | Pick and Place/Feeders

Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser

KingFei SMT Tech

Vitronics 6622CC Wave Solder

Vitronics 6622CC Wave Solder

Used SMT Equipment | Soldering - Wave

Model:  6622CC Vintage:  2006 Details: • Windows 7 operating system • Lead Free capable (was running lead, and will need tin wash). • 18” max width adjust • Measured Values Read-out of Frequency controlled motors on PC screen • 400V / 3 Phase

Lewis & Clark

Takaya APT9411

Takaya APT9411

Used SMT Equipment | In-Circuit Testers

TAKAYA APT9411CE Needle count: the upper 4 (movable) under lateral 2 rings (not moving) Detection speed: the highest 0.08 ~ 0.08 SEC/step Repeated positioning accuracy within + - 50 um Tip the minimum test distance is about 0.2 mm Maximum size p

Kingtest Asset Management(HK)Co,Ltd

Nutek NTM4610-X

Nutek NTM4610-X

Used SMT Equipment | General Purpose Test & Measurement

Nutek NTM4610-X Laser Marker (2006) Brand: Nutek Model: NTM4610-X Type: Laser marker Serial #: 2006-0096B01 Year: 2006 Conveyor: Automatic Camera type: Hawk eye 1500 Interface: Smema Operational system: Microsoft Windows 2000 Pressure: 4-6

Tekmart International Inc.

Vi Technology 4000L

Vi Technology 4000L

Used SMT Equipment | SPI / Solder Paste Inspection

Vi Technology 3D SPI 3D Solder Paste Inspection System Model: 4000L 3D SPI Year: 2009 Accuracy and warp compensation Unmatched true resolution, accuracy and repeatability Full-featured absolute measurement of the full board surface, mapping to

LEL Tech

Agilent SP50 Series II

Agilent SP50 Series II

Used SMT Equipment | SPI / Solder Paste Inspection

Agilent SP50 Series II 3D SPI 3D Solder Paste Inspection System Model: SP50 Series II Vintage: 2006 Maximum board size: 510 by 510 mm (20 by 20 in) Minimum board size: 50 by 50 mm (1.97 by 1.97 in) Maximum board thickness: 4 mm (0.16 in) 2D an

LEL Tech

Cyberoptics SE300 Solder Paste Inspection Machine (2004)

Cyberoptics SE300 Solder Paste Inspection Machine (2004)

Used SMT Equipment | SPI / Solder Paste Inspection

CyberOptics SE300 (2004) Solder Paste Inspection Brand: Cyberoptics Model: SE300 Description: Solder Paste Inspection Serial: 10239 Year: 2004 Details: • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max pad size

Tekmart International Inc.

ASC International SP3D-ADC

ASC International SP3D-ADC

Used SMT Equipment | SPI / Solder Paste Inspection

ASC International LaserVision SP3D-ADC - 3D Solder Paste Inspection - Benchtop - Model: SP3D-ADC - Automatic Data Collection (ADC) for real-time control of SMT stencil printing - 3D Profiling Capabilities - Windows® XP interface Operating Sy

LEL Tech

Cyberoptics SE300 Ultra

Cyberoptics SE300 Ultra

Used SMT Equipment | SPI / Solder Paste Inspection

CyberOptics SE300 Ultra 3D SPI 3-D Solder Paste Inspection Machine Model: SE300 Ultra Vintage: 2008 Good Functional Condition - Recently Taken Offline Multi-Panel 1-D and 2-D Barcode Read w/ System Sensor Mechanical Board Stop Solution Less th

LEL Tech

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