Electronics Forum | Mon Sep 09 11:02:45 EDT 2002 | mk
No change in Vendor. Here is some additional info from this morning, There are no shorts, opens, or visible defects. The problem is that when the boards are ICT'd, the values of the resistors, caps etc are measuring out or tolerance????? Can the go
Electronics Forum | Mon Sep 09 11:20:50 EDT 2002 | ksfacinelli
I have never seen that occur when using gold plating vs. HASL. I am a big fan of the gold process and have achieved very consistent quality. Did the board vender do an impedance measure to validate you design?
Electronics Forum | Wed Sep 11 14:11:59 EDT 2002 | blnorman
We had a similar problem with components being out of spec, course our problem was that they were coming in out of spec, not being damaged by our process. Do you do any incoming inspection?
Electronics Forum | Wed Sep 11 15:49:10 EDT 2002 | stepheno
Are you no clean or WS? Have you used a MultiMeter to verify the ICT failures? Maybe the components are fine but the pins are contaminated. Or the test points. Don't have any reason to suspect that due to HASL vs gold. It's just I don't trust data o
Electronics Forum | Tue Sep 10 13:42:49 EDT 2002 | cyber_wolf
Is anyone out there currently using Mydata's new Agilis feeders in production ? If so how long have you been using them, and how well do they work compared to the older style feeders? Thanks in adavance.
Electronics Forum | Tue Sep 10 14:30:51 EDT 2002 | ksfacinelli
Does anyone have a link to a good resource explaining NAFTA qualification standards for electronic assemblies
Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Wed Sep 25 11:11:14 EDT 2002 | xrayhipp
Try .005 or even .004 thick laser cut electopolish stencil and reduce grain size of paste. Go with 400 or 25 in the case of AIM. We had a similar prob.
Electronics Forum | Wed Oct 02 15:08:37 EDT 2002 | Eric
See Fiske first line. I'd bet You are bending or catching the assembly in the ICT. How many probes at 8OZ each? do you use on that ICT? 800 probes = 400lbs. See "Flexure induced failure of BGA solder joints" by Compaq Houston TX
Electronics Forum | Tue Oct 15 13:35:57 EDT 2002 | Chris Dill
Stress analysis on a component is available ECT (fixture house) Feel free to contact me @ (401)739-7320 x3337 for info. Chris
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