Electronics Forum | Wed Sep 25 15:03:17 EDT 2002 | davef
Mike: You're correct, but a newbee doesn't care. A newbee is so thankful to just get through the clutter and ACTUALLY have the thread posted [and maybe get someone to respond with something that they can use to get their boss to just shut his BIG y
Electronics Forum | Wed Sep 25 07:53:10 EDT 2002 | zanolli
Send me a drawing or sketch and I may be able to reccomend a supplier. fax: 401-781-5730 phone: 401-785-4110
Electronics Forum | Tue Oct 08 19:02:03 EDT 2002 | mjabure
Have you checked out autosplice? their URL is http://www.autosplice.com. They may be able to help you out.
Electronics Forum | Tue Sep 24 14:48:10 EDT 2002 | ChrisN
Looking for outside company that recycles matrix trays and plastic reels for surface mount components. I am trying to find a company that will provide boxes and be willing to pickup our reels and matrix trays to return back to suppliers for refund.
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Thu Sep 26 12:21:24 EDT 2002 | dragonslayr
What are the specs of a Formica type bench top? Gloss or mottled finish? Should the edge be straight, rolled or bull-nosed? Can I get it in ESD safe composition? Can you recommend a good calibrator of formica?
Electronics Forum | Thu Sep 26 20:26:35 EDT 2002 | davef
I got one, but you don't need one. Coy, eh? Oh, but these measurements need to be soooo precise, don't they?
Electronics Forum | Thu Sep 26 20:25:06 EDT 2002 | davef
When we DOE a board, we use the following independent print variables: * Print pressure * Print speed * Separation speed * Aperture orientation * Squeegee hardness
