Electronics Forum | Wed Nov 30 11:43:15 EST 2005 | russ
You will be fine as long as you don't run BGAs this way. I would imagine that you have already been doing this for some time already. You might need to increase peak temp and or time with some of the lead finishes.
Electronics Forum | Wed Nov 30 12:11:15 EST 2005 | russ
I would recommend that you search this site. There has been a LOT of discussion on this.
Electronics Forum | Mon Dec 12 13:13:34 EST 2005 | Kris
Mika Can you please share the manaufacturer name or links to the documents that you have with this restrictions ?
Electronics Forum | Tue Dec 13 08:08:54 EST 2005 | Amol Kane
Grant, Have you looked at the microstructure of your lead-free BGAs soldered with leaded paste? how do they look?? the reliability of LF BGAs with leaded solder is extremely poor.
Electronics Forum | Fri Dec 16 21:16:38 EST 2005 | Frank
The RoHS legislation says that it possible to have an exception from lead. That means that You are allowed to have Pb in the solder joint! While the component and the pcb must be RoHS compliant! Isn't that fun?
Electronics Forum | Mon Dec 19 17:14:16 EST 2005 | Chris
Here is a study from Motorola. Lead free is full of confusion and contradictions. This report may help. http://www.freescale.com/files/netcomm/doc/package_info/MPC8250PBFREEPKG.pdf
Electronics Forum | Tue Dec 20 08:48:33 EST 2005 | DannyJ
Finally found the second article mentioned... http://www.emeraldinsight.com/Insight/ViewContentServlet?Filename=Published/EmeraldFullTextArticle/Articles/2190170202.html Dan
Electronics Forum | Thu Jan 05 12:26:20 EST 2006 | Rob
The larger BGA's can also warp more under higher temperatures which causes ball lift, more noticable towards the edges of the package.
Electronics Forum | Thu Jan 05 17:10:04 EST 2006 | russ
The CCGA packages that we install are still a tin/lead alloy and not a SAC alloy. They were 90/10 SN/PB. I beleive that this may be one reason why the difference.
Electronics Forum | Wed Feb 01 09:44:23 EST 2006 | mmurison
See the paper presented by M Simard Normandin at the International Lead free conference in Toronto May 24th 2005 link to the paper is available on our website under the event http://www.muanalysis.com/about/events.html
