Electronics Forum | Tue Dec 13 13:01:24 EST 2005 | bobpan
We use a conveyor before our oven and put a footswitch on it to send the next board or jump the pins so that it just sends the board depending on delay needed.
Electronics Forum | Thu Dec 22 07:43:35 EST 2005 | grantp
Hi, That's true, and the plant just does not look high tech without that PC on the front of the wave. I should donate the wasted processor cycles to the SETI screen saver if it's still going on. Regards, Grant
Electronics Forum | Tue Dec 13 21:20:52 EST 2005 | davef
Certain solder pastes are more affected by humidity than others. Search the fine SMTnet Archives for more on controlling humidity in your plant.
Electronics Forum | Tue Dec 13 22:25:29 EST 2005 | davef
Kathy-Sunnyvale We've talked about Mydata machines quite abit here on SMTnet. Search the fine Archives for background discussion.
Electronics Forum | Tue Dec 13 21:13:55 EST 2005 | davef
We know nothing of your checklist. Download your free copy of ANSI/ESD 20.20 standard here: http://www.esda.org/s2020.html
Electronics Forum | Wed Dec 14 21:19:36 EST 2005 | davef
Heavens to Murgatroyd, we agree with Russ that "black pad" could be the cause of your solderability problem, but oxidized nickel is an additional explanation. While its often easy for assembler to jump this conclusion, it sounds like you've been bla
Electronics Forum | Thu Dec 15 16:12:56 EST 2005 | davef
Liza Could increases in adhesion due to exposure to high temperature and humidity in storage environments be an explantion to this cover tape excessive bonding issue? We agree with GS that heat bonding is so 1970s. Most heat bonders can fairly eas
Electronics Forum | Thu Dec 15 19:45:15 EST 2005 | Liza
Hi Rob, I would be asking the customers about that. I've read somewhere that teflon is used on feeders, is this a standard and does the absence or presence of this contribute to tape tearing? Thanks, LIza
Electronics Forum | Thu Dec 15 19:49:23 EST 2005 | Liza
Hi GS, I forgot...coming from what you said about aging, the complaints we received come from products that were processed 3-6 months ago. Based on your experiment, should this age affect the quality of the seal? Thanks a lot, Liza
Electronics Forum | Thu Dec 15 09:05:44 EST 2005 | russ
These random shorts, are they most prevailent on the edges, corners, or truly all over the place. It almost sounds like package warp/delamination or something of that nature. Are you baking parts per MSL requirements?
