Electronics Forum: thread (Page 2566 of 7890)

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 06:11:42 EST 2007 | shy

Hi Loco, my PCBA got top side and bottom side and 90% SMT and 10% THP (top side) which need to be cover by wave solder. And that's why i need to go through reflow and wave.

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 07:27:58 EST 2007 | realchunks

I'm still confused. Why reflow solder a part when you're going to wave solder it? Seems like a waste of resources and material.

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 07:36:29 EST 2007 | shy

solder the part is for SMT component (located at top side and bottom side) and wave solder is for THP (located at top side only).

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 07:44:59 EST 2007 | davef

We do not paste when we glue. We glue components so they will stay inplace during wave soldering. In wave soldering there is ample solder to bridge the standoff between the component and the pad.

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 07:51:21 EST 2007 | shy

is there any gap between the pad and terminal if we place the glue? Btw, my practice to print solder pate then punch glue then PNP component and finally reflow. Also we find drop/missing chip after wave eventhough we glue the component.

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 08:21:43 EST 2007 | shy

How many mils the gap between the terminal and pad? Your practice is for technology SMT-4? What is problem with glue cure? is it due to the reflow profile? how long the glue can be keep in room temperature with humidity 40-60?

Epoxy on bottom of SMT component

Electronics Forum | Wed Nov 28 06:52:33 EST 2007 | davef

So, you're curing glue on a thermal recipe intended for reflow even though your supplier recommends that you cure at 150C, because you want to use paste that isn't necessary.

Epoxy on bottom of SMT component

Electronics Forum | Wed Nov 28 06:56:57 EST 2007 | shy

the paste is necessary for the component that had no glue. btw, for solder paste specs, 150C is at reflow time plus soaking time and i believe it will cause nothing to the glue and can cured as per recommended? correct me if i'm wrong.

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 13:35:04 EST 2007 | slthomas

It's OK, really. Stephen is carrying the torch for you now, although I don't know if dave is in or out at this juncture.

Epoxy on bottom of SMT component

Electronics Forum | Thu Nov 29 14:20:05 EST 2007 | realchunks

Shouldn't someone LIGHT the torch first? Good ol' Adolph starting a tradition that carries into today.


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