Electronics Forum: thread (Page 3786 of 7890)

Re: Micro solder balling

Electronics Forum | Fri Oct 27 08:59:17 EDT 2000 | Wolfgang Busko

Antonio: A lot has been said on this topic before. You might try the archives with "solder balling" and than check your process step by step ( you will find enough ) to find the cause of your problem. Any other advice would be repeating and repeating

Re: Wave Soldering 0.050 pitch connector

Electronics Forum | Sat Oct 28 10:13:27 EDT 2000 | KF Lok

1) Try to keep lead as short as possible. 2) The long side of the connector in the direction of conveyor. 3) Use pallet, design such that the connector is 45 degree to the wave.( or conveyor). May not remove all shorts but reduce to one area i.e. th

little plastic caps: what does it all mean man!?!

Electronics Forum | Wed Oct 25 12:38:55 EDT 2000 | Robert Russell

I had a customer come to me the other day and he asked if I had the little plastic caps that go over the feeder arms of the fuji machines. He said that come in "Red" and "Blue". Do those colors mean anything, or is it just a preference of what a pers

Re: little plastic caps: what does it all mean man!?!

Electronics Forum | Thu Nov 02 10:42:02 EST 2000 | pr

I don't know about you, but plastic just screams blue to me. As long as it's consistant I wouldn't think it'll matter. Hopefully this'll appease your customer and you can move on to tidying up all the other (less important) but still meaningful aspec

Re: Solder paste SPC analysis

Electronics Forum | Thu Oct 26 17:58:49 EDT 2000 | Dave F

Steve: You make sense, but I don�t see where someone that's getting fitted for a cross is in much of a bargaining position. Oh, and you MUST charge full market 2� rates for your thoughts. We�ll have no submarket price offerings. Although, the Fai

Densipak placement

Electronics Forum | Wed Oct 25 02:09:43 EDT 2000 | keith_hodgson

We are using a Universal GSM to place Densipaks.Unfortunateley every so often we hit a spell were the Densipak is raised because either one or both of the locating posts on the Densipak has not located correctly in the hole. These are very hard to re

Release difficult from thick stencil

Electronics Forum | Tue Oct 24 09:35:56 EDT 2000 | Wister

Our important customer demanded us to use 12mil thick stencil,it is too difficult to release solder paste from stencil.it is not helpful even I ask stencil supplier polished the openings.The flux content is 10%. I want to ask if the polyurethane sque

Re: Release difficult from thick stencil

Electronics Forum | Tue Oct 24 17:04:03 EDT 2000 | Darby

Sorry,I can't help you with your problem, but would it be possible for your customer to take a little time to explain the reasoning behind their demands? I am sure we would all like to know. What are you putting on these massive deposits? Trends in b

Re: Wavesoldering

Electronics Forum | Sun Oct 22 21:18:13 EDT 2000 | Aokilab

This may be the "wetting" problem! Assuming your process parameters are normal (work OK before), the possible reasons: 1. Presence of impurity in the solder; 2. Other impurity (oil or anti-dross) on the surface of the pot; 3. Weak solderability, due

Re: Wavesoldering

Electronics Forum | Mon Oct 23 21:18:14 EDT 2000 | Dave F

Unlike components where the solder paste has been reflow soldered, wave soldered components have an "infinite" amount of solder available to make a solder connection. If you have good solder flow, pad and component termination size are going to be b


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