Electronics Forum | Thu Mar 23 22:20:51 EST 2000 | Dave F
Chris: I'm unsure about the kits you seek. Solderability of: * Components: J-STD-002, Dip And Look Method. Malcom Instruments makes a very nice tester. * Boards: IPC TM-650 2.4.12A Solderability, Edge Dip Method Good luck Dave F
Electronics Forum | Tue Mar 21 17:32:48 EST 2000 | Charles Barker
Greetings all you knowledgable SMT persons! 1. Typically, for multi-layer (6-8 layers), FR4, SMT boards stored in an air conditioned environment at about 50+/- 10% RH, how many months (or years) would you allow to pass before you would recommend bak
Electronics Forum | Tue Mar 21 20:30:48 EST 2000 | Dave F
Marc: Experimental evidence is rare. Published reports are rarer. I can�t comment on the impact of rework on your RF boards. I can tell you that: � HF is pretty LF these days. � We allow three rework actions on each aboard. � IPC-7721 is a fine s
Electronics Forum | Mon Mar 20 09:24:38 EST 2000 | John Sipper
1. Spec references for max allowable untinned gold near glass seal and case body? 2. Low cost mechanical dip system to facilitate tinning of DIP parts. (Low volume; currently using hand solder iron techniques to allow for max coverage without bridg
Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F
Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even
Electronics Forum | Mon Mar 20 10:54:36 EST 2000 | Glenn Robertson
Jack - The last time I checked IBM was specifying a minimum of 4800 cubic mils of paste for each pad. This is required for acceptable reliability, not just to make the connection. There is no way you are getting that volume with a 5 mil stencil
Electronics Forum | Thu Mar 16 09:01:28 EST 2000 | Ashok Dhawan
I am looking for suggestions on " How to remove solder Balls". We have some designs and tools where nothing can be done economically except to remove the solder balls manually. We are using "Probe" picks to do that job. Anyone who can suggest a bet
Electronics Forum | Thu Mar 16 07:02:38 EST 2000 | Scott Davies
Does anybody have any experience or knowledge of processing PCB assemblies featuring pyroelectric sensor devices, the type used in Passive Infra-Red Sensor modules? Since these devices are, by definition, very sensitive to heat, how do you get round
Electronics Forum | Mon Mar 20 08:50:47 EST 2000 | Dave F
Scott: Pyros don't like to be heated, so soldering should be done as quickly as possible. Other tips are: * Keep pyro leads long. * Apply solder to the ends of leads. * Heatsink the lead, while soldering by holding the lead with a pair of pliers
Electronics Forum | Wed Mar 15 01:20:08 EST 2000 | Dreamsniper
Do we really need not to locate vias underneath discrete components on a PCB that will be wave soldered after reflow even though we are using no clean process on our wave solder ? What are the possible cause and effect when locating Vias under discre
