Electronics Forum | Wed Jun 06 03:12:06 EDT 2001 | ianchan
Any blokes in process/QA, can recommend a solder volume, measurement machine, that has proven reliability, in its data readings, prefer that it comes, similar to "SMT m/c" camera-program-function, to remove operator-user variation. Appreciate any hel
Electronics Forum | Thu Jun 07 13:08:18 EDT 2001 | Vince
Our company is considering venturing into new territory and developing an electronic product. Would anyone have any links to sites that offer general information on developing cost for electronic manufacture? Essentially, I'd like to find out what
Electronics Forum | Wed Jun 20 14:02:50 EDT 2001 | raton
I'm interested in the masking boots and covers you mentioned. We have looked at them before, but we use an acrylic conformal coat and clean up with toluene. All of the boot type products we have looked at seem to breakdown in toluene. Do you reuse
Electronics Forum | Sun Jun 10 23:49:17 EDT 2001 | Robert Sykoh
No-clean is definitely a cheaper process. It will eliminte cleaning. Some issues associated with no-clean are: -- the flux stain left behind on the PCB will create a cosmetic issue. You may want to seek advice from your customers. -- next, the flux
Electronics Forum | Sat Jun 09 09:32:26 EDT 2001 | davef
Yes, your pallet will absorb / steal heat. It sounds like you are doing a good job in understanding the issues. Yes, the pallet could be the problem. Is this a new run that you are starting? Or has everything been OK, but recently you've begun to
Electronics Forum | Thu Jun 14 01:29:33 EDT 2001 | ianchan
Hi mate, thanks for the "starwars project" irk, it sort of sets my rump on track to "lah-lah-land", i need help here, coz this fric'kin pcba, is going onto a control panel, for a governmental fighter jet, ianchan / QA 14 june 2001
Electronics Forum | Thu Jun 14 10:50:49 EDT 2001 | slthomas
I must be missing something.....why can't you simply attach thermocouples, profile the assembly, and adjust your zones as required to reach the parameters required by your paste and component specifications? Is there a restriction on that process fo
Electronics Forum | Sun Jun 10 11:08:26 EDT 2001 | nifhail
I know that there is no pre-defined strength for the solder joint as it will depend on solder volume deposited, pad geometry, lead component's lead solderability etc. but, what would be the best ball park for the good joint for 0402, 0603, 20 mil pti
Electronics Forum | Mon Jun 11 10:41:16 EDT 2001 | techment
Can someone helps to interpret the IPC-A-610's requirement on solder balls ( less than 5 mils in diameters.). We found about 6 to 10 balls ( less than 5 mils ) scattered in a 600 sq mm board. Is it consider failing for class 2 product ?. Thank you.
Electronics Forum | Tue Jun 12 10:13:10 EDT 2001 | techment
Thank you, Mr Dave. Specifically, there are tiny balls spreading on the boards ( on top of solder resists, and not encapsulated). They are not near to any land/pad or connector. I do not think they post any electrical problem. They are quite far away
