Electronics Forum | Fri Sep 21 09:29:49 EDT 2001 | steven
when taking a reflow profile, can i attach the thermalcouple to the component body (using high temp tape) instead of to the leads (often found thermal couple dettached during reflow). in general, what is the temp diff between these 2 locatinos. if so
Electronics Forum | Sat Sep 22 09:07:56 EDT 2001 | davef
Back-stepping a bit. If a profile is being used to: * Set-up the oven for a new product or trouble-shooting process, the profile should be taken with a solid contact to a solder connection. * Monitoring on-going stable and in-control process that re
Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Fri Sep 21 11:59:26 EDT 2001 | Carol Stirling
We build IPC Class 3 product and are introducing Plastic Ball Grid Arrays. There is a possibility of out-soucing the build, so I'm interested in the Standards or Specifications the industry is quoting to ensure placement, inspection, reliability etc.
Electronics Forum | Thu Sep 27 18:25:20 EDT 2001 | Ed Ruppert
Hello Daniel, You may want to take a look at MYDATA for your large board requirements. MYDATA has board sizes ranging from our smallest of 15"x 20" up to 32"x 44" with other sizes in between. You can find more info at our website: MYDATA.com We ha
Electronics Forum | Wed Oct 10 00:12:42 EDT 2001 | laujh
May I join in this forum also? Does Universal has any new/special platform avaiable in the market to handle board size up to 20" x 32" and thickness 0.300". The current HSP 4796A and GSM1/2 can only handle board size up to 14" x 18" and 18" x 20" r
Electronics Forum | Fri Nov 09 14:34:30 EST 2001 | vickt
As mentioned in other replies, the Universal GSM has expanded capabilities....As for the UIC HSP's....the 4796L can handle an 18" x 20" panel as standard, and has options to go up to 18" x 24.5". Did I mention that the 4796L places at a 0.10 tact ti
Electronics Forum | Tue Sep 25 15:48:34 EDT 2001 | mparker
Scavenge all the old solder off the board and the chip. Micro screen paste to the chip. As far as thickness, check your aspect ratio to determine the spec. Eliminate just one variable at a time to get to the root cause. Start by not using the tacky
Electronics Forum | Mon Oct 01 04:01:08 EDT 2001 | wbu
You got the right feeling for that I guess but what if somebody else is doing your trick, is it still repeatable? Personally I wouldn�t trust that method more than the brushing. Did you try the dipping method ? The thing from Dave with this "card-com
Electronics Forum | Wed Sep 26 11:59:26 EDT 2001 | mparker
Electrically, the part still works, even if upside down. When upside down, you cannot see the part identifier. If you are an OEM and your QA/QC people don't freak out because they can't read the part, let it go. If you're a CM, your customer would
