Electronics Forum | Fri Nov 11 09:06:08 EST 2005 | russ
We use at least an 8mil thick stencil for these parts. The Columns do not collapse or reflow so you need to ensure plenty of solder volume for reliable attach and to make up for the coplanarity of the component itself. I assume we are not really ta
Electronics Forum | Tue Nov 01 08:50:26 EST 2005 | James
I've recently been subjected to a procedure that requires the first 2 solder paste prints of a production run to be wiped down and not used for the build. This is to condition the stencil aperture walls? and insure good print deposition. Is this a
Electronics Forum | Tue Nov 01 09:21:39 EST 2005 | jdengler
I've never heard of this before. If your solder paste is at the correct temperature, and your process is under control you should have an acceptable print the first time. This sounds like a terrible waste on time and paste. Set up a DOE to prove tha
Electronics Forum | Wed Nov 02 04:28:58 EST 2005 | Simon
Hi James, I have worked in many SMT sites and this is not an uncommon practice. It is true that print deposit consistency will improve after the first few prints as the aperture walls become lubricated, but with modern stencils/paste and a well-desig
Electronics Forum | Tue Nov 01 09:57:18 EST 2005 | Chris
Hi, I am experiencing cracked solder joints on ceramic resonators after the ultrasonic plastic weld process. PCB assy is placed into plastic housing and then housing halves are ultrasonic welded. Not a soldering problem. I know this component is
Electronics Forum | Tue Nov 01 20:48:53 EST 2005 | erokc
I am forced to use fine pitch parts in a new design. Board alignment in production has to be addressed. Fudicals, where to place, shape, size. I'm assuming they must be in the copper to represent the pad positions. Are they placement machine depe
Electronics Forum | Wed Nov 02 01:24:07 EST 2005 | arnold
we are encountering a problem on our production. after dipping a copper wire AWG#30 to a leadfree solder the wire becom thinner and easily to break. does the leadfree soler has the capability to weaken the wire (lessen the diameter)after dipping to l
Electronics Forum | Wed Nov 02 22:06:54 EST 2005 | davef
Slaine, our intuition is the same as yours [that 100Sn should dissolve the copper faster than other solders]. Bob Gilbert's FCT data shows otherwise. Look here: http://www.fctassembly.com/newsltr/2004/0804/Aug04.htm
Electronics Forum | Wed Nov 02 14:45:26 EST 2005 | chunks
Here's the info on Gel Flex: http://www.adhesivesmag.com/CDA/ArticleInformation/products/BNPProductItem/0,2109,120109,00.html http://www.speedlinetech.com/docs/Gel-FlexBrochure.pdf#search='Gel%20flex' I agree, the Grid Loc was not all it was crake
Electronics Forum | Wed Nov 02 11:14:45 EST 2005 | Doug
I am doing lead free testing on a Vitronics selective machine with a 4 mm nozzle. The finishes I am testing are ENIG, ImSn, and ImAg. The problem I am encountering is achieving good top side wetting. Has anyone had any luck with this type of an ap
