Electronics Forum: thread (Page 4891 of 7890)

SMT Reflow temp

Electronics Forum | Mon Mar 16 11:40:56 EDT 2015 | swag

If it took you a long time to get it through pick and place or you had to do a lot of hand add of SMT parts, your paste can start to dry out especially on the small deposits. We've seen this time and time again. We've gotten way better at quickly p

SMT Reflow temp

Electronics Forum | Thu Apr 16 10:11:51 EDT 2015 | hugh_manatee

Your solder paste manufacturer’s profile is just a “guideline.” You can customize your profile to meet your product’s need. For better grain-structure (shiney-ness) try a ramp soak spike profile keeping your preheat temps very low before your reflo

Inventory control and maintenance

Electronics Forum | Tue Feb 24 16:11:15 EST 2015 | emeto

I assume you have a part number system. If so, you should kit the reel with less parts first from the same part number. If you don't use part number system, then you probably have components sorted by value and size, which should lead to the same pri

Inventory control and maintenance

Electronics Forum | Wed Feb 25 11:42:29 EST 2015 | emeto

What software do you use to track your parts? We use Manex - it is not perfect but still gives you the opportunity to track parts/jobs relations. For example I know in each moment one particular part goes to 5 currently open jobs. You should explore

BGA Rework (Top side heat only!)

Electronics Forum | Tue Feb 24 17:16:11 EST 2015 | grauen06

I was handed the task to develop a process to solder a BGA using topside heat only. It is a long story so I will spare the details, but I was wondering if anyone has ever attempted this? I have been going at it for a few weeks with fair results, but

BGA Rework (Top side heat only!)

Electronics Forum | Thu Feb 26 12:24:02 EST 2015 | emeto

The best test will be to X-ray BGA under 3-D X-ray. About the techniques used for BGA repair you can probably take closer look to some BGA repair stations, even though I have seen it done with hot air gun in the early days.

BGA Rework (Top side heat only!)

Electronics Forum | Fri Mar 27 12:59:22 EDT 2015 | ppcbs

That is a strange task. I must ask what is the purpose? When performing BGA Rework the goal is to recreate the manufacturing process of using the reflow oven. It is important to have even heat of the BGA and PCB from top to bottom. Using top heat o

Mydata

Electronics Forum | Wed Feb 25 12:36:18 EST 2015 | Svajunas Astrauskas

Our company have Mydata MY100DX mashine. When assembling project it lags. Assembling - several seconds thinking (sometimes till 10secons) - assembling and this problem repeats all time. When button is pushed it sometimes reacts only after 1-10 secon

Anyone with Conceptronics HVN70 spares?

Electronics Forum | Thu Feb 26 10:38:00 EST 2015 | swag

We don't have parts around anymore but I can offer a tip that might help. Our conceptronic is gone but the major issue we had with it was bearings going out on blowers. We rebuilt them in-house. Found a high temp. bearing through a bearing supplie

PCBA Id using Laser marking

Electronics Forum | Wed Mar 04 22:24:28 EST 2015 | SKR

We are using Nutek NTM4910-XL laser marker to etch 2D barcode on all our boards. We added solid silkscreen box on all our boards to create contrast. When we laser etch them, we just burn the silkscreen box so that we can see the soldermask under it c


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