Electronics Forum | Mon Jul 11 10:48:48 EDT 2016 | mnorthey
I have experienced this problem on a number of different machines and have found that it has been one bad nozzle causing the problem. We run Juki 3010 and 3020 and occasionally we have had similar problems. One question, is it bad placements on all 6
Electronics Forum | Mon Jul 11 10:59:50 EDT 2016 | mnorthey
Other problems on previous machines that we have experienced is that there was not enough board support under the panel or that the panel thickness was inaccurate. Both situations can cause parts to bounce off the PCB or not to be pushed into the pas
Electronics Forum | Mon Jul 11 13:21:40 EDT 2016 | bradholland
well there you go. I found that trying different values in the "Placing Stroke" had a big effect. I changed it to 2mm and it placed them well, but I could see the board also flexing a little, went to 1mm and the problem came back, so have sat in th
Electronics Forum | Tue Jul 12 10:33:24 EDT 2016 | dontfeedphils
I'd start by checking and reteaching the nozzles (this is automatic, it'll measure the nozzle length and vacuum values for each nozzle). After that double check the value you have entered for the PCB thickness as this will impact where the machine t
Electronics Forum | Wed Jul 13 17:50:26 EDT 2016 | davef
From "Assembly" magazine, "Moisture-Sensitive Devices" [ http://www.assemblymag.com/articles/85082-moisture-sensitive-devices ] ... a description of the moisture sensitive device problem. I agree with Evtimov * During board assembly solder process,
Electronics Forum | Fri Jul 15 12:02:45 EDT 2016 | davef
This conversation is making my head hurt. Before your engineers respin the design, some basic questions need answers. * How do you know that the field failures were caused by MSD damage? * What is going on in the field that is causing these failure
Electronics Forum | Fri Sep 09 05:58:58 EDT 2016 | jswatt
yoru x-ray supplier should be able to help however you can do a rough cut calculation byt just printing it out and measuring it, your interested in ration (%) of the void and where in the joint it is to tell you it it's really an issue. Also importan
Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev
Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering
Electronics Forum | Mon Jul 18 22:31:25 EDT 2016 | cmchoue
Hello, Experts I have a question about Through hole SMD part in SMT process The PIN Length can't over PCB board how many that will happen defect? any advice or data(IPC rule maybe) ? Thanks Wish you have a nice day
Electronics Forum | Tue Jul 19 03:06:42 EDT 2016 | ishwarsingh1
Upside down placement of a crystal oscillator is acceptable or not ?? As per IPC 8.3.2.9.2 Rectangular or Square End Chip Components – 1, 3 or 5 Side Terminations.I am not sure whether is applicable for crystal oscillator or not . Your answer wo
