Electronics Forum | Sat Oct 21 03:55:14 EDT 2000 | DL
Dennis, I've seen this before, and in our case we didn't need to seal the edges because there was no concern of shorting or anything in the end product, this is a choice you will have to make, Does your end product have any protrusions or mounting h
Electronics Forum | Tue Oct 17 13:37:54 EDT 2000 | dpoling
We have this same model and are very disappointed with it. It has several issues that we do not like: 1. The solder feeder has never worked properly. 2. The fingers are very soft material and bend easily. 3. There is no way within the machine to adj
Electronics Forum | Mon Oct 16 11:10:51 EDT 2000 | PeteC
Excessive bridging on SOICW-20, -16, SOIC-8, -14,-16. I've got a board, 4" x 6" w/ SOICs on bottom-side for wave solder. I've checked topside board temp for flux activation, wave height, wave surface with the glass check-plate going from 1" to 2" spa
Electronics Forum | Tue Oct 17 01:42:34 EDT 2000 | Peter Carry
Dave, That's the funny thing, thru all that the output was pretty consistant with at least one bridge per board. * The ICs are going thru the wave in-line, according to IPC-782 figure 3-9, "Preferred IC Orientation". * Flatness of second wave is cont
Electronics Forum | Wed Oct 18 04:04:16 EDT 2000 | Dreamsniper
What's your topside Bd. Temp before hitting the Wave ? Have you done profiling on your machine? What solder alloys you are using (might be due to incompatibility with flux)? Is the IR lamp between pre-heat and Chip wave ON during the operation? Wh
Electronics Forum | Thu Oct 19 00:54:26 EDT 2000 | PeteC
Top side temp. is 97C before the wave. No, we don't have the IR lamp on; we did try it though with no positive change. Solder alloy Multicore 63/37 Other boards run better. This one is the worse. We have not had good success eliminating bridges on SM
Electronics Forum | Mon Oct 16 00:45:33 EDT 2000 | soza
Dear sir, I have a problem to find the new chemical solution instead IPA(isopropyl alcohol) to eliminate contamination on the test pin socket board made from copper that plate with nickle and gold. And after the often testing IC process, the co
Electronics Forum | Sun Oct 15 23:31:39 EDT 2000 | mkwong
I have a question for N2 reflow, I want to know how difference of the O2 PPM in reflow oven then get the result? Now, we use the N2 to purge into BTU oven and measure the O2 PPM is about 1,000. but cannot find the difference to compare to compress ai
Electronics Forum | Sun Oct 15 20:09:42 EDT 2000 | mech9t9
Does anyone out there use the DEK FormFlex? I am looking to find out the advantages/disadvantages of using it. Also, are there any problems that you have come across with the FormFlex (pin sticking)? Does the FormFlex reduce setup time drastically? C
Electronics Forum | Tue Oct 17 18:10:05 EDT 2000 | Philip A. Reyes
Yes, you need to conduct X-ray inspection for BGA-SMT assembly, but it doesn't mean 100%. If your process is well capable and robust you can do sampling. There is an available X-ray machine that right now Iam assessing, cause we are going to buy one.
