Electronics Forum | Mon Apr 23 11:31:23 EDT 2001 | Cal
You may have answered your own question. If SSD is the end all save all there would be more people using this technology. I view SSD as an option to have flat planar pads. I also know the price per Board is more then "standard" boards. The sample b
Electronics Forum | Fri Nov 16 08:18:25 EST 2001 | Matt Kehoe
Dave, Sorry, but I did not answer all your questions from your earlier message. Your Question Are you saying that these products were not developed in Euroland? Answer Well, SIPAD was invented in Europe, 1986, Siemens Lab in Munich Germany. Optip
Electronics Forum | Tue May 08 17:50:56 EDT 2001 | Philip
Barry, Process Sciences, Inc. does something called the SMT bootcamp. It is an intense two day course that takes participant through the entire SMT process. The course is taught by a senior process engineer. We are doing a course in Chicago and D
Electronics Forum | Tue Apr 24 10:05:09 EDT 2001 | Robert Steltman
Help please.... We have just run a prototype board using a number of BGA devices on it. The corners on two of the BGA's (PBGA357) seem to be higher than the centre of the device. ie the outer bumps seem to be "stretched" compared to the centre bumps
Electronics Forum | Wed Apr 25 10:37:14 EDT 2001 | davef
If you heat a BGA too quickly, the corners of the device will curl towards the ceiling [potato chip], because they come to temperature faster that other areas. Adding to this, thinner substrates tend to potato chip more and faster than thicker subst
Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark
BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think
Electronics Forum | Tue May 01 18:38:44 EDT 2001 | djarvis
Barry, We have two of the MV models, one that we bought second hand, and the other new. The " i S " means inline? We love the MV's, which are offline, semi-auto, vision aligned. Just a great machine. Simple, intuative software, all parameters easy to
Electronics Forum | Tue Apr 24 12:56:39 EDT 2001 | Steve
We are experiencing a fair amount of skewed components, mostly 0805 resistors and capacitors, during the reflow process. We have pretty much ruled out the pick-n-place and have determined that it may be happening because of variables at the paste scr
Electronics Forum | Wed Apr 25 07:57:36 EDT 2001 | wbu
Steve: Try to find something that�s common to all your skewed parts. We haven�t had much trouble with it except for some MELF diodes a couple of years ago which didn�t look well aligned but made no trouble with specs. Better suited pad design solved
Electronics Forum | Wed Apr 25 09:12:52 EDT 2001 | zam_bri
Hi, Can anyone advise what would be the possible cause of having the same short problem at the same spot even after 3 time rework, with a brandnew BGA. I have rework boards with BGA shorts. The problem is most of the shorts boards, will passed afte
