Electronics Forum | Fri Oct 22 10:35:56 EDT 1999 | Graham Naisbitt
Armin, I can supply you but wont. Why not? Because these materials have a short shelf life when packed into syringes. Your local supplier should be able to provide them but he will be obliged to make up a batch of 2 - 300 to be economical - but they
Electronics Forum | Wed Oct 20 16:55:26 EDT 1999 | NickMata
Hello all, I am trying to get some information on ENTEK CU56. I am planning to use 310M flux on ENTEK 56 cards. It will not be a double reflow (top/bottom) followed by wave. I plan to reflow, glue/cure then wave. I am concerned about burning off the
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Thu Oct 21 21:17:19 EDT 1999 | Jeff Ferry
Mark, A challenge for sure. I suggest you review two techniques for this type of rework\modification. The first method uses a special circuit track run out from under the BGA. See: Jumper Wires, BGA Components, Circuit, Track Method at http://www
Electronics Forum | Wed Oct 20 05:13:24 EDT 1999 | Paul Gerits
Hi Jorge, As you know SMEMA is a world standard (means it is the same at every vendor and each machine), at DEK you can buy (if not already implemented in your printer) SMEMA communication option. This is a pcb which is set in the machine to enable
Electronics Forum | Thu Oct 21 10:13:19 EDT 1999 | Bill Bannister
The Brady PAM 5000 may work for you as well. I think they have a web site. This machine is smema compatible. It's automatically places barcode labels onto pcb's within an 18"x22" area with .020" accuracy. The labels can be placed at 0 or 90 deg onto
Electronics Forum | Fri Oct 29 10:39:48 EDT 1999 | JohnJ
Bill, Thanks for the input. I took a brief look at the Brady machine on their website. I think their latest is the PAM 6000. It didn't appear it could keep up. My most difficult application is to put 42 labels on a 21-up board in under 1 min 20 sec.
Electronics Forum | Fri Oct 29 10:57:45 EDT 1999 | JohnJ
We considered direct marking already John. It's not very practical for us to do that. We need to put labels on components as well as boards. A laser or inkjet would cause us to have to change too many things in our processes. We'd still need to do la
Electronics Forum | Mon Oct 18 20:06:27 EDT 1999 | Phuc Nguyen
I am researching a process call Collumn Grid Array for the BGA. Please email me if you have some knowledge about this process. The problem is ceramic BGA has different thermal coefficient with PCB (FR-4) material, and in extreme temperature (-40 C-
Electronics Forum | Fri Oct 22 09:44:42 EDT 1999 | John Bashe
The CCGA package is difficult to handle and automate in the assembly process. The leads can be fragile, and vision recognition of the package and leads is difficult. Special lighting and/or a special vision algorithm will probably be needed if you wa
