Electronics Forum | Sat Jul 05 07:30:04 EDT 2003 | AlCapone
If the problem as you described as the gold plating contaminated, and the Nickel layer exposed to the solder pot. However, the purpose of the gold layer is to protect the nickel and copper layer not turn into corrosion and resist to other issue (humi
Electronics Forum | Tue Jul 08 20:43:03 EDT 2003 | davef
AlCapone: We have an understanding similar to yours, but slightly different. * At 230*C gold dissolves in to solder at the following rate: 63/37: 197 uinch/sec [5 um/sec]. So for a typical ENIG solderability protection, the gold is gone in about a s
Electronics Forum | Mon Jul 07 09:32:28 EDT 2003 | caldon
There are companies that provide technologies to do this: Manncorp has a unit - http://www.manncorp.com/p-m-7500rb.htm and Winslow Automation - http://www.winslowautomation.com and http://www.ape.com/reball_kits.html and companies providing thi
Electronics Forum | Wed Jul 09 10:55:51 EDT 2003 | Veronica
Hi Reman01, I have done that before when I was in Motorola. What kind of ball are you trying to repair? How many pieces of BGA chip do you need to repair a day? If it is not too many, you can do it by yourself. It is a lot, such as 100 to 1000 piece
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Wed Jul 09 16:18:51 EDT 2003 | Matt Kehoe
Hi Russ, Thanks for the input. The squeeze out we are reworking is very very thin since it has been flattened so it is actually easier to remove than usual but I agree, with a pad this small it could exert a bit of stress on the bond line if rework
Electronics Forum | Thu Jul 10 15:00:58 EDT 2003 | russ
Louis, For whatever it is worth, When I have $5000 parts I don't even mess around with a rework station. I would mask off any heat sensitive components (We use water soluble masking like that for wave soldering) and then process through the oven yo
Electronics Forum | Wed Jul 09 17:07:51 EDT 2003 | msjohnston
Like many others out there I am new to SMT assembly on flex circuits. In the past, we purchased flex assemblies manufactured from a sub-con. Now we will be building internally. Are there any guidelines when building products with flex circuits? Wa
Electronics Forum | Thu Jul 17 09:26:28 EDT 2003 | Mike J
Mike: We have provided many carriers for flex circuit applications to facilitate processing through screen print, pick-and-place and reflow and, in many cases, eliminating the need for taping the flex circuit to the carrier. Please contact me and w
Electronics Forum | Wed Jul 09 18:02:48 EDT 2003 | slthomas
Just when you think you're getting somewhere... QA sent me a vendor response to our corrective action request. They stated that their normal process for this product includes an ultrasonic cleaning cycle of 20 MINUTES minimum. It might be 30, we'r
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