Electronics Forum | Wed May 14 18:22:07 EDT 2014 | hegemon
Dave is touching on one of those magical things that keeps us process engineers well paid and dancing (Well, some of us, lol). Heavy boards with light components. Solder Follows heat. Component heat up earlier. Repeat, Solder follows the heat. Care
Electronics Forum | Thu Jun 05 19:19:13 EDT 2014 | FD
When you assign the feeder location, there is a default XY value that gets assigned to that location. When you teach the actual XY pick position you move away from that default position, and if the actual pick position is too far away from the defau
Electronics Forum | Fri Jun 06 02:35:06 EDT 2014 | maciejbilu
Got it. That make sense. Pick position is quite far from these "normal" one. I ignore the message (and press start button again) every time and the whole mounting process starts normally. JUKI mount every component assigned except one from 44mm feede
Electronics Forum | Tue May 20 04:34:59 EDT 2014 | sarason
Well that would be a response from the VME bus. Is the PCBoard, the only controller on the buss, or is there a second controller that talks to interface boards etc. If so you might just have a problem with the second controller. Check the control sig
Electronics Forum | Wed May 21 15:13:56 EDT 2014 | wendynguyen234
Sarason, thank you very much for your support. There is an ISA interface board with just ribbon cable from window 95 PC to VME I/O DPRAM ver. 2 board in the same VME rack that has MVME-162-110 (CPU board), DSP, ADDA, AXIS & CONT boards. Do you think
Electronics Forum | Tue May 20 07:55:27 EDT 2014 | andrzej
Hi, I am facing an issue with PB-free HAL on our boards (270 pcs of 800pcs lot). I look for a root couse for this issue and I guess it is strongly related with PCB manufacturing process. In attachment you can see PCB with dark pads. They turned grey
Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Fri May 23 09:27:37 EDT 2014 | emeto
Hello, these pads look so clean.....I am not sure you had a good solder connection there. I would check the following. 1. Is the part RoHS in a lead process 2. X -ray boards after reflow(I assume you will see head in pillow) 3. Check for board con
Electronics Forum | Fri May 23 23:45:38 EDT 2014 | edriansyah
Hi Evtimov. 1. yes both part and the process are lead free/RoHS 2. I ever did X-ray, the balls shape are good and I dont see any evident of head in pillow (but my x-ray machine is not too good) Head in pillow was also my first suspect. but after the
Electronics Forum | Fri May 23 23:58:48 EDT 2014 | edriansyah
Hi Hege. I was not also too confident with the black pad (coz no black residue on the remaining pad). But based on my search on the internet regarding black pad. Most of them shows a very clean BGA Pad after peel off the BGA as the picture reference
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