Electronics Forum: thread (Page 6226 of 7890)

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 04:36:16 EDT 2017 | Rob

@ Sr.Tech, Any voiding means that the part of the package under the void is not forming a solid thermal interface with the PCB, therefore it's heatsinking capability is reduced. With the drive for smaller packages with higher power handling capabil

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 08:47:50 EDT 2017 | emeto

From what I know, you should follow IPC standard for the class assembly that you are building. From your post somebody mentioned something somewhere - doesn't make it official information. I would not be worried about having voids, but what is their

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 09:53:58 EDT 2017 | rob

Hi Etimov, Understood that to us assembling parts that IPC is king, however it isn't neccesarily the bible for design engineers. We've had customers demand almost zero voiding, or had to use conductive epoxy to avoid it. For some of us solder joi

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Wed Mar 15 10:21:08 EDT 2017 | pzappella

Hello Rob, I totally agree with you. Is this a real problem that is being shoved under the rug or just whatever voiding we get from a belt furnace is good enough. I think vacuum reflow can do much better but is a batch approach and not contin

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Thu Mar 16 03:45:51 EDT 2017 | rob

It's the same thermal issue whether it's a die or package. It's different if it is just a signal trace, but if it's a heatsink pad (LED, FET, Motor driver, PSU IC etc). I think the voiding issue boils down to what the part is actually doing. The or

What is the QFN or Device Voiding Levels Needed for Automotive Industry for Power Devices for Electric Vehicles?

Electronics Forum | Thu Mar 16 19:12:22 EDT 2017 | pzappella

Hi Rob, Thanks for the LED paper. I like the void area equations but I am puzzled, the paper did not say if the solder was a solder paste that would generate a lot of voids, or a fluxless preform or sinter material. The measured voiding level

MPM Sigmaprint 400

Electronics Forum | Tue Mar 28 19:43:49 EDT 2017 | aemery

Simon, Trying to dust off my 400 knowledge here, I can picture the 500 and 1500 better in my head. I think the 400 also has a Z axis amplifier box in the back of the machine. Remove the rear lower door and pull out the big square vacuum box. If it

MSL control

Electronics Forum | Thu Mar 16 22:19:38 EDT 2017 | deanm

First, reflow does not reset the clock for MSL exposure. The best solution is to run the second side before the exposure time expires. I am curious to know why they must sit for 40 hours. If that cannot be done, then store the assemblies in a dry c

Tools For Cleaning PCB after Soldering

Electronics Forum | Thu Mar 16 01:43:15 EDT 2017 | soldertraining

Hi! I have a very basic question about PCB cleaning. Which is the best way to clean the PCB after soldering? We use a lead free solder wire (3,5% flux inside the core) and after the soldering its a visible wetting,flux around the joint. When using th

Xray Analysis of non-BGA solder joints

Electronics Forum | Thu Mar 23 02:10:59 EDT 2017 | alexeis

Hi, Based on our experience, you can collect X-Ray analysis of solder joints and calculate values of SPC (such as PP/PPK and GR&R). Now, you can find, based on this calculated values, if your production is good or not. Also, this helps you to detect


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