Electronics Forum | Tue Aug 13 23:09:25 EDT 2019 | action_101
The best one is NOT one of the guns that the sales reps had to be deceiving to get their promotional pitch in without being up front on who he was or the other rep who tried to capitalize on the other A-holes deceiving tactics.... RIDICULOUS Contact
Electronics Forum | Sun Jul 14 04:39:35 EDT 2019 | alexeyzb
I have changed job and now i have some problems. Previous experience was with high volume production and not so high quality level (class 1, 2 according IPC). Now i need to produce very high quality (and very expensive) PCBAs in Low volume production
Electronics Forum | Mon Jul 15 18:11:36 EDT 2019 | slthomas
First question - is your company already compliant with and/or certified to AS9001? If not, is your company compliant with and/or certified to ISO 9001:2015? There are several overlapping requirements. If the answer is no to the previous and you pla
Electronics Forum | Thu Jul 18 17:41:31 EDT 2019 | rgduval
The UFP was a designation for "ultra-fine-pitch"; but, for the most part, you should be able to get the same placements out of both machines. Anything 0402 or above can be mechanically centered. The UFP machine will lean on optical centering for .5
Electronics Forum | Tue Jul 16 12:24:25 EDT 2019 | slthomas
In VERY general terms, water soluble flux is usually better at getting good wetting of the soldered connections unless you have a very well controlled process, in which case no-clean can be very handy (you don't have to clean). Water soluble flux re
Electronics Forum | Wed Jul 17 17:56:38 EDT 2019 | rgduval
Check the MOT board. You can usually swap out the individual MOT boards, and see if the problem moves. If it does, you can isolate which board has gone bad. You can also check the encoder on the conveyor, to make sure that is still working correct
Electronics Forum | Thu Aug 22 16:25:18 EDT 2019 | scotceltic
Yes, unfortunately a lot of datasheets these days do not contain the temperature resistance to determine if it can handle the PIP application. In the past I have always used a 250 C at a min of 5 sec for the material. Also, the part should have sta
Electronics Forum | Tue Jul 23 11:06:00 EDT 2019 | majelacquinn
Currently trying to get away from using stencil printing. Looking for information on Micro-Dispensing and dot size using a Vermes MDV-3200A micro jet dispenser. I am using a Indium led free solder that has size 6 balls. With a 100 micron dispense hea
Electronics Forum | Tue Jul 30 12:46:15 EDT 2019 | davef
I'd be surprised if CCGA leads were getting bent or tilted during the reflow soldering process. If they were bent during handling, that would be less surprising. 235*C on the body for a minimum peak temperature of 208*C at the connecting leads does
Electronics Forum | Thu Aug 22 22:19:13 EDT 2019 | sssamw
From the picture you present, it is a pin in paste part with pin length 2.2mm (a good length for 1.6mm PCB thickness), and seems the pin tilted and touch on PCB surface, thus causes up-part. Sorry I cannot image pin tilted not before placement but i
