Electronics Forum: thread (Page 6416 of 7890)

Re: ESD Compliant - Air blow off to dry washed circuit board assemblies

Electronics Forum | Tue Apr 11 20:23:19 EDT 2000 | Dave F

Ashok: You're still goin' down that ol' ESD road aren't ya bud? Why do you need the boards to be dry? Conformal coating? Hey wait a minute, are you one of those no-clean people? Er zis related to the Kapton tape res fandango? Anywho, be careful

Re: Thru-hole Moisture sensitivity

Electronics Forum | Tue Apr 11 20:37:06 EDT 2000 | Dave F

Rich: Now that�s a great question!!! You�re corrrect. Primary-side temperature is the driver of the differences in the sensitivity to moisture between SMT and PTH devices that you�re finding. * Primary-side temperature for SMT ~= Secondary-side te

qfp and soic joint Problem

Electronics Forum | Tue Apr 11 10:30:46 EDT 2000 | Jeremy Smith

I am having a problem with some joints on a 100 pin pqfp and few different soics on one particular board. When viewed a 8x with a "Mantis" inspection scope the joints look as though they wetted to the ic leg but when probed the leg will pop loose.

Re: qfp and soic joint Problem

Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert

I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i

Re: qfp and soic joint Problem

Electronics Forum | Mon Apr 17 19:30:27 EDT 2000 | Boca

All of the above is good stuff. To add, I have seen this several times if the assembly is wavesoldered. Heat from the wave can partially reflow the top side SM solder joints and weaken them. To test, check joint strength before wave and then after

Re: WAVE SOLDERING 0603 CHIP RESISTOR ARRAYS

Electronics Forum | Tue Apr 11 20:31:54 EDT 2000 | Dave F

Russ: You�re correct. I should have explained our reasons for preferring concave over convex better. First, we use both also ... we just prefer concave because they: * Don�t bridge any where near as easily. * Self-center better. * Seem to have mor

Re: S.P.O.T.T.

Electronics Forum | Mon Apr 10 09:48:43 EDT 2000 | Dave C.

John, having worked at a major U.S. telecommunications co. I can tell you we were placing through hole connectors in SMT. Using MPM printers 3000 2000 AP36 AP24. We opened the apertures on the stencil 25% over lead diameter to allow more paste(it wou

Re: S.P.O.T.T.

Electronics Forum | Tue Jun 11 09:35:42 EDT 2002 | mcmilse

I know this is from a long time ago but you were actually printing paste into through holes and placing? How was the paste working? Or better yet what kind of paste were you using? I work in a military enviroment and our paste is out dated(technol

Re: S.P.O.T.T.

Electronics Forum | Tue Jun 11 14:58:45 EDT 2002 | Chris Lampron

Hello Sean, We are currently using a Pin in Paste process to mount some through hole relays. This particular board has 72 relays per. We have cut the stencil to overprint the hole. By putting a small amount of solder in the hole to flux the lead, th

Re: S.P.O.T.T.

Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc

Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs


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