Electronics Forum: thread (Page 6466 of 7890)

Re: PCB interval during reflow process

Electronics Forum | Fri Dec 03 03:58:12 EST 1999 | Wolfgang Busko

Hi Charly, For batch ovens there is no discussion. For inline loading interval depends on the oven you use, the amount of heat the PCB takes out of the zone and the capability of the oven to get it back in. The approximate time for the PCB to stay i

Re: PCB interval during reflow process

Electronics Forum | Sun Dec 05 22:43:27 EST 1999 | dreamsniper

Charley, Though my reply is quite late, it might be a good info for you and i hope that this info could help or could provide you some views. Some companies practice at least 1 board gap, which means the length of the pcb you are currently loading,

Re: D-Pak misalignment Problem

Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron

Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Fri Dec 03 18:17:12 EST 1999 | Dave F

Dave: There's lots of stuff on the web describing BGAs. Examples are: http://www.smtnet.com/bookstore/publications/0speckdo1/s1.html http://www.smtnet.com/bookstore/publications/0shutcco1/ch1p2.html http://www.citizen-america.com/OEM/bga/process

Re: What is the typical BGA substrate pad alloy

Electronics Forum | Wed Dec 08 10:10:41 EST 1999 | John Thorup

Hi Dave I think you just provided the key to understanding the problem. By your description you are talking about a CBGA (ceramic). These typically have balls composed of 10/90 Sn/Pb which melts at a higher temperature than the 62/36/2 Sn/Pb/Ag (or

Call for Papers for SMT Express

Electronics Forum | Wed Dec 01 14:01:46 EST 1999 | Michael Bryant @ SMTnet

SMTnet.com is issuing a Call for Papers for future issues of its popular SMT Express newsletter. The SMT Express is a monthly periodical featuring electronics manufacturing solutions and insight from engineers, managers, and sales professionals, as w

Re: In House or Out

Electronics Forum | Thu Dec 02 11:42:03 EST 1999 | John S.

Dick, My company made the transition from thru-hole to SMT about a year ago. We've been building thru-hole boards successfully for years, but our customer requirements have forced us into the transition. Wolfgang made a very good comment. Start s

Re: SMT Zero-defect Soldering

Electronics Forum | Thu Dec 02 11:28:03 EST 1999 | Mark D. Milward

Dave F. Thanks for the info. I've spoken with Ralph and Les Hymes in the past and have taken Manko seminars before. I read something not long ago that Dr. Juran had written on the subject of Zero-defect soldering programs and was hoping for response

Re: Info. on Stencil cleaners

Electronics Forum | Mon Nov 29 13:29:49 EST 1999 | Bill Schreiber

Dear Jason, We keep several published papers, written by industry experts, on our Web Site: www.smartsonic.com click on the "Recommended Reading" button. The Smart Sonic Stencil Cleaning Process is the only cleaning process that is Certified by

Re: Info. on Stencil cleaners

Electronics Forum | Mon Nov 29 16:36:31 EST 1999 | Curtis T.

Jason, We have been running both the high pressure and the ultrasonic washers for several years and there is no comparison. The ulrtasonic (smartsonic) does a great job on all the normal pastes, and when we changed part of our production to a new ep


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