Electronics Forum: thread (Page 6661 of 7890)

Number of component scraped during feeder loading

Electronics Forum | Tue Jun 25 11:26:11 EDT 2002 | pdt203

Sometimes when a customer has sent parts on reel without any leader, we will take out the first 5-8 parts and then tie off the cover tape with some leftover tape from the last run. We keep those parts we removed and then place them back in the feede

Solder Robbing Pads

Electronics Forum | Wed Jun 26 09:10:21 EDT 2002 | davef

I want to suggest: * IPC-2221, Generic Standard On Printed Board Design * IPC-222X, Sectional Design Standard For Printed Board For Y Printed Boards ... but I just thumbed through both quickly and saw nothing, I really didn't spend as much time as I

Reflow PBGA

Electronics Forum | Tue Jun 25 15:30:49 EDT 2002 | Steve L

Hi everyone. I am now faced with a problem on soldering PBGA. At first, I ran the board (FR4, 7" X 10" with 12 layer) at Peak Temp: 205 C and 54 seconds above 183 C. After reflow, I found several cold solder joints and one ball without second collaps

Reflow PBGA

Electronics Forum | Wed Jun 26 01:01:24 EDT 2002 | ianchan

Steve, Dason has valid points here. dun listen to what supplier's say about paste lying on the PCB pads able to be exposed at ambient temperatures for 8-24 hrs? that will never get approval for Class-3 type of customer auditors. (Would any serious

Reflow PBGA

Electronics Forum | Wed Jun 26 11:29:53 EDT 2002 | slthomas

Go to the top of the page and enter your topic in the "Search SMTnet" window. It can take some tweaking to get it dialed in to the exact topic you want. Do you mean the paste was on site for 3 weeks, or was it actually out of the fridge for 3 week

Reflow PBGA

Electronics Forum | Wed Jun 26 21:41:46 EDT 2002 | ianchan

Hi mate, "no more than 6hrs in the stencil" for us means: 1) we finish setup of reflow oven, P&P m/c, and lastly the printing machine(includes loading of stencil into printer machine). 2) once printer machine is setup, we rip-open the paste Can pr

Reflow PBGA

Electronics Forum | Fri Jun 28 16:21:03 EDT 2002 | russ

Is that 5 top and 5 bottom zones? We use a 4 zone and a 3/4 zone oven for BGAs and have success. I don't believe that the amount of zones is the issue but what type of profile you can get out of them. I will admit that the large ovens are much eas

Capacitor

Electronics Forum | Sat Jun 29 10:05:54 EDT 2002 | davef

First, it is very reputable that your supplier is giving you notification of this product change. Second, comments on the previous discussion are: * Sales-types do good things, but most times commenting on technical issues is better left to others.

Palladium finish and solder balls

Electronics Forum | Thu Jun 27 11:22:03 EDT 2002 | robbied

Hi there. We have had an out of control reflow oven that has allowed its temperature to fluctuate by up to +/- 20 deg C from set point in very short periods of time. We found the root cause of the problem and fixed it, but by then we had already run

solder crack

Electronics Forum | Mon Jul 01 20:42:54 EDT 2002 | davef

Comments [questions] are: * It�s strange that an uggie ol� SOIC, 50 pitch, BIG honkin� solder pad, kinda thang is failing. Sumpin aint kosher, yano? * Where is the failure occurring [ie, lead to pad, pad to board, etc]? Talk about the breadth and di


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