Electronics Forum: thread (Page 6746 of 7888)

Small blister, solder mask

Electronics Forum | Wed Jun 23 13:34:29 EDT 2004 | df_indy

I am four weeks into my new job, there always seems to be some issues here with PCB every week. Today while I was checking some assemblies with micro-scope, I found a lot of tiny bubbles/blisters on the board. They are just little dots if you look

How to qualify move from water wash SMT process to No clean?

Electronics Forum | Thu Jun 24 20:28:58 EDT 2004 | needhelp

We design PCBAs. Our CM assembles the boards for us. So far we have used waterwash SMT process to build the boards. Accidentally, due to documentation errors, we suddenly have a huge batch of boards built with No-Clean process. Although the boards pa

QC Job Definition

Electronics Forum | Fri Jun 25 08:55:47 EDT 2004 | Vincent

Hi, I am tasked to implement process change in our mfg floor. And one of the big problem that I can see is that to change a company culture where QC dictates the process and inspects every PCB. From what I know QC conducts random Inspection and oper

Grainy Solder Joints

Electronics Forum | Fri Jun 25 17:33:17 EDT 2004 | davef

Nonductile fracture!!! Sounds peculiar. In that case, stop wasting you time messing with the thermal recipe. Either your: * Components have poor solderability [test this by dipping the leads of a couple of the SSOP in your solder pot and then asse

Flex circuits

Electronics Forum | Sat Jul 03 10:03:22 EDT 2004 | Bryan Sherh

Things to consider are: * Thermal expansion > characteristics of you flex and your pallet > should be better matched. We use G-10. * > Placement of your two sided tape should be > better, more uniformly distributed. We run strips > the length o

Electromigration Testing

Electronics Forum | Sun Jun 27 10:48:46 EDT 2004 | crios

I am a Quality Engineer which went from an Automotive QS9000 company manufacturing ceramic hybrid boards and now I am with a ISO PC mfg. company dealing with PCBA boards. I've been assigned a task in determining the contributing factor to high contam

Electromigration Testing

Electronics Forum | Wed Jun 30 18:12:59 EDT 2004 | crios

Thanks for the information. davef, I will search for and review the Ion Chromatography for Ionic Cleanliness test method. This definitely is the test I want to perform. Do you know what the IPC specification is using this test method? The outside

DEK265

Electronics Forum | Thu Jul 01 09:53:24 EDT 2004 | Simon

Can anyone help me with this? What kind of price > should I be looking to pay for a used DEK265 > machine? Year around 98'? Well , firstly It depends on the country in which you live as I can only advise in the UK. But if you live in the US try

Long Soak Times for BGA soldering?

Electronics Forum | Sat Jul 03 00:58:57 EDT 2004 | KEN

so what did we do before X-ray? sound process shouldn't need to rely on inspection. Extended soaks can be used to burn off high temp volatiles but I have never heard of 5 minutes! I have used 90-120 sec. to reduce solder splatter....but haven't do

Why AOI. Features one should look while considering AOI

Electronics Forum | Sat Aug 07 01:04:40 EDT 2004 | rsgupta

Why not.. You are always welcome. Firstly what I feel multicamera system (Top and Angled) AOI is always better than single Top camera system in terms of defect coverage. Secondly read On the fly inspection is much better than STOP and Go techniques.


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