Electronics Forum | Thu Jul 22 21:26:29 EDT 2004 | Grant
Hi, It's removed from the fridge, and the tube is loaded into the stencil printer, however it's winter here right now, so it's still quite cold. It's Australia, so when I say cold, that's relative, however the room can be about 10 dec C in the morni
Electronics Forum | Sat Jul 24 11:57:50 EDT 2004 | KEN
I wonder what that would look like? BUILD DCOUMENTATION Paste: OA XYZ-123 SOLDER PASTE. Note: Place refridgerated paste tube in Goldstar Microwave (3rd from the end of the break-room). Press "defrost" "forzen dinner". Do not defrost solder paste
Electronics Forum | Mon Jul 26 06:32:58 EDT 2004 | cyber_wolf
Grant, The only thing that you really gain from refrigeration is a couple more months� shelf life. Refrigeration also seems to slow down flux separation. I am not sure how your paste consumption is, but we use ours up way before the expiration date
Electronics Forum | Tue Jul 27 07:58:21 EDT 2004 | mmjm_1099
Hell as for storing the used paste have someone bring in baby jars. Yes I agree thats alot of wasted money if you throw it away every day. Plus since I'm on the subject why not use a bottle warmer? I persoanlly store our paste in a mini-fridge (along
Electronics Forum | Tue Jul 27 22:30:19 EDT 2004 | KEN
Sr. Tech, when you say you have never had a problem, what exactly does that mean? How do you know you have never had a problem directly associated with your solder process? Do you actively measure your defect levels? How do you maintain traceabili
Electronics Forum | Wed Jul 28 18:51:52 EDT 2004 | gregoryyork
Found problem many years ago by chemical extraction and IR analysis, produces alarming amounts of plasticizer from under cured or incorrect mix of hardener to liquid photoimageable solder resist. Problems this causes are endless and many things blame
Electronics Forum | Fri Jul 23 09:12:34 EDT 2004 | davef
We have run not AgPd [that we know of]. We can comment on PdNi. [But you're probably have Ni under the AgPd] In general, palladium solution rate is much slower than other sacrificial finish materials that we use for the purpose. The key then is to
Electronics Forum | Mon Nov 01 16:33:50 EST 2004 | bschreiber
Smart Sonic has an entry level component to our StencilScan AOI system called the Assembly Module GT. The Assembly Module GT is low cost and will get the job done. Plus, the Assembly Module GT can be upgraded easily to the other Assembly Module pro
Electronics Forum | Thu Jul 29 00:42:32 EDT 2004 | C.W
hello, BGA was a little excessively reflowed with dwell time(above 183C - solder paste = 63/37) over 2 min, peak temp is 218C. I inspected the BGA under X-ray and there is a little voids but within the acceptable range, i then used the Ersascope to c
Electronics Forum | Fri Jul 30 17:20:09 EDT 2004 | Francois Monette
A couple of other potential issues are moisture/reflow related issues. This can include internal delaminations inside the component, potentially breaking or lifting the wirebonds. It may also induce warpage where the corners of the BGA will curl up.
