Electronics Forum | Wed Feb 04 03:20:05 EST 2009 | smartasp
Hi All Reflow Gurus I have learnt that my process engineers do not consider the heat resistance, of the components when creating a reflow profile but rather try to stick to the paste recommendation. This has lead to a field recall as one component h
Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist
As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data
Electronics Forum | Tue Feb 10 21:12:08 EST 2009 | smartasp
Dear ALL Thanks for the valuable input so far. The solder results is the first priority whereby the solder paste requirements sets the guidelines for the profile first. We use Kick profiler with the latest software. We verify the oven temp and dist
Electronics Forum | Sat Feb 14 08:30:08 EST 2009 | smartasp
Thank you all for your valuable inputs. Have having done some more investigation we have realized that there is actually no standard as such to which the ROHS components have to be manufactured aside from the contains of substances like PB and al o
Electronics Forum | Wed Feb 04 10:24:05 EST 2009 | dyoungquist
We use SN100C in our selective solder process. The 3 keys to proper hole fill are applying a proper amount of flux, heating of the pcb and solder temperature. If either the pcb or solder is not hot enough, you may not get good hole fill. To adjus
Electronics Forum | Wed Feb 04 10:01:55 EST 2009 | dcell_1t
Hi there, We're developing a DOE where stencil design (aperture design) is going to be evaluated, currently we have regular reduction on sides, home base (triangular and semi-circle), "C" or "U" shape, and an idea for oval shape for pasives also cam
Electronics Forum | Mon Feb 09 20:06:15 EST 2009 | davef
Pallet fabricators are: * AGI; 177 Nick Fitcheard Rd NW, Huntsville, AL 35806; 256-858-3300 http://www.agicorp.com/ * Pentagon EMS; 10950 SW 5TH St, Suite 230, Beaverton, OR 97005; 503-924-2747 F503-924-2744 http://www.pentagon-ems.com * M&O Precis
Electronics Forum | Tue Mar 03 03:02:17 EST 2009 | emmanueldavid
25% out of Lands in PCB, Insufficient/Inconsistent Alloy deposition which causes for poor Tackiness between Device Spheres & Paste deposited. Also note that Aperture Opening Designs in Your Stencil draws a huge role for these defects. 4. Placement: P
Electronics Forum | Thu Mar 12 03:14:14 EDT 2009 | nibirta
Thank you for support. As i promised you, I am coming back with the results. The SM used was Probimer 77 with Kester 979 flux. The supplier says that there is an incompatibility and we have changed the flux with IF2009M. Same problem! They have chan
Electronics Forum | Tue Feb 24 15:31:44 EST 2009 | pcbrookie
Wrongway - Interesting about the rails. I'll check to make sure operators are leaving a little 'wriggle room' on the rails in case they are in fact getting narrower in the middle. SWAG - I suspected the initial temp. might be a bit hot, thus causin
