Electronics Forum: thread (Page 7031 of 7890)

Ficiduals, Best Practice

Electronics Forum | Tue Sep 06 12:39:06 EDT 2011 | deanm

According to IPC-7351A, the optimum fiducial is a solid circle with a minimum of 1mm diameter, but can be up to 3mm. There should be a solder mask clearance a minimum of 2x the radius of the copper circle. So the minimum fiducial size is 0.040" with

Which ESD totes to buy...conductive or dissipative?

Electronics Forum | Thu Sep 08 12:50:39 EDT 2011 | deanm

We use both the black conductive and blue static dissipative ESD totes in the production of Class 3 military electronic assemblies. In some cases we use ESD bags, but most board assemblies are placed directly in an ESD tote with a lid. The totes cont

SMTmax Pick & Place Machines

Electronics Forum | Thu Sep 15 19:12:27 EDT 2011 | smtmaxmary

WELCOME TO SMTmax Established in 2009, the Omxie Corp. is headquartered in California, with several offices worldwide. Our primary focus is in the development, manufacturing and marketing of SMT tools and equipment for prototyping and production. Ou

QFP footprint -extended outside pad?

Electronics Forum | Thu Sep 15 21:25:43 EDT 2011 | darby

G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say the pin width is 0.2mm and the pad design ha

QFP footprint -extended outside pad?

Electronics Forum | Thu Sep 15 21:36:52 EDT 2011 | darby

I also posted this in the design section... G'day folks - haven't been around for some time but still soldering on. Question for y'all. One of my design engineers has shown me a Creative PCI audio card with a TQFP48 attached. 0.4mm pitch. Let's say

Die Crack Monitoring (DCM)

Electronics Forum | Mon Sep 19 19:22:11 EDT 2011 | henrytcx89

Thanks for taking ur time to answer this. =) The pick and place machine is just pick from wafer(on tape) and place into waffle pack. I read from some of the sources saying that the ejecting needle and the vacuum pick up bits could cause the die to c

BGA underfill

Electronics Forum | Thu Sep 22 14:54:01 EDT 2011 | hegemon

You might find a lot of experience in the forum here, but maybe not so many consultants for this niche. BGA underfill is not rocket science, and in my opinion, the key items are the material chracteristics, and the dispensing method and pattern. Fo

Flux not foaming

Electronics Forum | Tue Sep 20 11:28:20 EDT 2011 | russw

We've got a Novastar 12S wave solder machine and we've been using Kester 951 flux for years with no problems. We just got a new bottle of 951 and it does not foam correctly (thin foam with lots of large bubbles). After a lot of back and forth with

Reworking BGA's

Electronics Forum | Wed Sep 21 17:53:19 EDT 2011 | action_101

I would like some input on reworking BGA's and the best method. I have reworked BGA's since 1998 using both micro stencils and just flux dipping the parts. I have reworked SN/PB and lead-free (AIM NC258) BGA's for the last 8 yrs. with just flux. I ha

Dek 265 GSX motor comms failure ...

Electronics Forum | Thu Sep 22 18:47:08 EDT 2011 | rodrigo

Hi all, We just got this machine and it is not fully functional. I read somewhere here that the folder mint has some useful stuff. I run mint and it said that it cannot communicate with card 0,1,2,3 (x1,x2,x3,x4). It said to make sure the cards are


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