Electronics Forum | Mon Aug 06 10:03:01 EDT 2007 | slthomas
I agree with jdengler on the rotary table being skewed. You need a couple of dowel pins (1 1/2" long x 1/4" dia., I think) to align that disk. Each idler is held on an eccentric cam and can be adjusted to square up the rotary table by dropping the do
Electronics Forum | Fri Jul 27 10:07:18 EDT 2007 | rgduval
Our preference has been ENIG. We find that we achieve higher quality (visually) soldering for through hole and surface mount parts, with less handling issues than when we use white-tin, or immersion tin. We are about to do a test on some boards tha
Electronics Forum | Tue Aug 14 16:26:21 EDT 2007 | slthomas
So it's a C-n-C clearance issue? Could you go with the other cutnclinch unit...which ever you have, get the other one (one's right angled, one's offset at 45�)? Yeah, I know, they're not cheap. Other than that, hand place some of the SMT in chip bon
Electronics Forum | Thu Sep 20 14:30:20 EDT 2007 | chef
I would appreciate any and all input on selection of ICT/ATE equipment. I'm a CM supplying various PCA's, none of which are designed with test points. I am looking for a robust, user friendly, low cost, low maintence that can be easily adapted for ea
Electronics Forum | Fri Nov 09 07:40:07 EST 2007 | jdumont
Thanks for all the great suggestions guys. We do not have topside heating but topside temps are where they should be before hitting the wave. No excessive copper in the area either. We are going to start with the most problematic board and use it as
Electronics Forum | Mon Dec 03 18:35:52 EST 2007 | stevek
I don't know how accurately you're going to be able to put a replacement down. You could use BGA replacement pads, but that is a lot of time and the results will be shakey. On the DEK, make a copy of your program and teach some pads or through hole
Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Fri Aug 15 00:51:30 EDT 2008 | boardhouse
Hi Paul, My discloser, I sell for an offshore house, this is Crap.... Section 3.4.3 Annular Ring (External) of IPC-6012A, which also calls out Table 3-5, states that "Plated-through holes identified as vias can have up to 90 degrees breakout of t
Electronics Forum | Mon Jan 12 02:45:53 EST 2009 | sachu_70
Hi Stefano, Although your concept of Wave soldering such devices is possible, I would look at an alternate solution. An easier way would be to Reflow solder all Bottom side SMD components with solder paste, followed by wave soldering for only through
Electronics Forum | Wed Sep 23 15:16:22 EDT 2009 | davef
Santiago can still maintain his current PTH, SMT, Reflow, Glue, Wave solder process flow and print glue with a stencil. In this, the bottom-side [contact-side] of the glue stencil requires cutting pockets that correspond with the clinched PTH leads.
