Electronics Forum | Mon Sep 20 13:04:25 EDT 2004 | davef
The Intel BGA Developer�s Guide [ http://developer.intel.com/design/packtech/ch_14.pdf ] says: 14.8.3.3 Plated Through Hole (PTH) Isolation Regardless of the technique used for the mounting pads shape or definition, isolation of the plated through h
Electronics Forum | Fri Mar 15 14:27:21 EST 2002 | stefwitt
Assuming, you have nothing on the other board side, I would drill a hole through the trace and board with a step drill and a drill press. If you adjust the depth control carefully the wider step of the drill scratches the surfaces of the trace to mak
Electronics Forum | Fri Jun 04 15:04:16 EDT 1999 | Earl Moon
| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The
Electronics Forum | Thu Jun 04 09:25:21 EDT 1998 | Chrys
| | | Hello: | | | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold jo
Electronics Forum | Mon Jun 08 15:00:08 EDT 1998 | Earl Moon
| I work QA at an OEM in Alberta, Canada. I saw earlier posts on the smtnet regarding PCB haloing criteria. I am currently in a dispute with my PCB vendor over the acceptability of haloing (delamination) around plated through holes and vias on a lot
Electronics Forum | Wed Sep 07 09:34:15 EDT 2005 | PWH
Does anyone know of an IPC standard that deals with drilled holes in a PCB in relation to pad location? We have a PCB where the holes are very close to (through the edge of in some cases) a SMT component pad on a PCB.
Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis
| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots
Electronics Forum | Mon Dec 04 11:14:03 EST 2000 | JimH
All, For what it's worth the only time I have experienced this phenom was when board support pins were misplaced on our chip shooter and these components (previously placed) were resting on the pins and cracking when we populated the other side o
Electronics Forum | Fri Nov 10 17:47:50 EST 2000 | Dave F
I can�t imagine a high trace count, high via count ceramic board matching-up on price with a FR4 board. http://www.coorstek.com/coorstek/coorstek.asp?menu=literature&reference=literature.asp But that�s not really the issue, is it? The issue is the r
Electronics Forum | Wed Oct 25 06:14:14 EDT 2000 | Adam
Guys A question regarding design rules of a WSC.We are currently running a high volume product, and as usual the design layout is as such where half the through hole connectors are perpendicular to the wave, and surprise,surpise the other half are'n
