Electronics Forum | Mon Oct 17 05:35:00 EDT 2005 | Rob
Hi Harrit, We are processing SMT eleco's normally - up to around 8mm in height, the larger sizes can still be avoided and are through hole as the cost of them outweigh the benefit of surface mounting them (although we did get good results on test fo
Electronics Forum | Mon Dec 05 17:53:04 EST 2005 | KEN
I hate to sound like a broken record but the industry has been placing lead free through-hole parts forever. Now all of a sudden its a problem??? Gold finish, silver, silver paladium, alloy 42, even pure copper. Reliability will be a function of t
Electronics Forum | Wed Dec 06 07:24:22 EST 2006 | davef
Successful solder paste overprint is a function of the solder paste rheology, solder mask and through hole component stand off. * Solder mask with a high surface energy will permit a larger overprint than a solder mask with a lower surface energy. In
Electronics Forum | Thu Dec 11 04:25:06 EST 2008 | lconnor
I have previously experienced dispensing glue dots using a camalot system. This was used to dispense dots for a variety of components, as the SMT was applied post through hole and then wave soldered. No paste was used in the process. The other benefi
Electronics Forum | Tue Jan 27 10:31:14 EST 2015 | dbrazel83
We have a surface mount connector from Hirose that has two through hole mounting pins on the side. The solder is wicking up the pins into the body of the connector during reflow, even with adjustments to the PCB solder mask which came directly direc
Electronics Forum | Tue Jan 27 10:52:22 EST 2015 | dyoungquist
Taking a shot in the dark...... Are you using the correct oven profile for the connector? Solder tends to flow (wick) towards the hottest part of the connection/pin/pad it is on. It may be that the hottest part is the connector itself where the pi
Electronics Forum | Wed Aug 01 15:18:40 EDT 2018 | dleeper
One option might be to convert the coil to through hole and use intrusive reflow AKA pin in paste. the coil leads would have to be formed perpendicular to the board instead of parallel. you would have through holes instead of SMT pads, but you would
Electronics Forum | Wed Jun 14 01:24:14 EDT 2006 | AR
Thanks ;) We even did some product development on that one. We took a normal bar of wave soldering alloy, sawed a suitable length off it and drilled a carefully measured hole through the bit of solder. The hole is wide enough so that the blister tap
Electronics Forum | Thu Apr 22 16:54:28 EDT 1999 | John W
| I need to know if there are any special component pad designs that need to be considered when evaluating paste-in-hole? We have a few through hole connectors that are good candidates to place pre reflow. Does anyone have sugguestions. | Thanks |
Electronics Forum | Mon May 07 11:09:49 EDT 2007 | davef
4 Fluxer Operation 4.1 Set-Up and Check-Out the Fluxer 4.1.1 Spray Fluxer Set-Up and Check-Out 4.1.1.1 Pass a sample unsoldered board through the machine. 4.1.1.2 Remove the board just after passing through the fluxer and the air knife. 4.1.1.3
.gif)
