Electronics Forum | Sat Dec 09 09:51:14 EST 2006 | pvasquez
Hello Lou, As a high-mix low-to-mid volume manufacturer, you will need to concentrate on equipment that may be progammed very easily, with very quick debug time from assembly to assembly. I have worked with Agilent in the past, and one of my collea
Electronics Forum | Fri Dec 08 08:25:03 EST 2006 | jhaviland
Depending on the system you can program in a loop where if the board fails a contact to cycle the vacuum once or twice. it wears on the pins a little faster since you cycle 2 times (maybe more) per board but it could help increase the FPY. I know Gen
Electronics Forum | Thu Nov 30 10:01:52 EST 2006 | realchunks
It depends. If it's a current desing that can't be changed, we go outside the box on any issue to see if we can build it. Then it all comes down to time versus dollars. If it's a new product we offer suggestions to the customer and try to bang out
Electronics Forum | Thu Dec 07 21:08:48 EST 2006 | Cmiller
it is not that I am aware of either. Make sure you get your boards from a house that does the gold plating in-house or you will continue to have the problem. The gold needs to be plated immediatly after the nickel, not a few days later. I have only h
Electronics Forum | Wed Dec 06 15:59:04 EST 2006 | realchunks
Chris, you need to get out more. I haven't seen a DOS only MPM in many years. Most MPMs do have that new fangled Windows on em'. Shoot, even seen one of them fancy flat screens on one (in the rich parts of the neighborhood)! Seth, what type and y
Electronics Forum | Mon Dec 11 17:19:12 EST 2006 | darby
Hi AJ, Thanks for the reply. I'm beginning to think that we have some issues with different expansion rates of the two pcbs. When you say you had some profile issues... Did you stay within the recommended UBLOX reflow time of 20 - 40 seconds and di
Electronics Forum | Sat Dec 16 09:42:41 EST 2006 | Frank
Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefo
Electronics Forum | Sat Dec 16 09:47:53 EST 2006 | Frank
Hi all, Having been designing (3d modelling and programming) stencils and tooling (solderwave carriers,print support etc) for several years I am now investigating whether it would be possible to do this from home. I live in the UK and am therefore ab
Electronics Forum | Tue Dec 19 03:46:24 EST 2006 | en
I facing problem when running glue process. the glue size cannot maintain with the same size when the glue in syrince reduce. it become smaller, smaller and smaller compare to the time. Beside, when there have any changing model, the machine stop for
Electronics Forum | Tue Dec 19 08:32:44 EST 2006 | davef
Take your choice: * Can't image this is a good thing. The board under the die will 'dry-out' and turn brittle over-time. It's possible the way attachment glue bonds to the board will change as the board dries-out. * Epoxy suppliers pad their number
