Electronics Forum | Sat Nov 17 18:16:46 EST 2007 | jwsmt
You mention moisture in the part as a cause of cracking during reflow. What does this type of crack look like? How was it determined that moisture was the culprit? The resonator is near the middle of the PCB, but is about 5mm from a large hole (abo
Electronics Forum | Thu Dec 06 23:41:33 EST 2007 | er_pe
Not only is "designing for the processes is good", it should be required and enforced. Obviuously, one should not conider 'every' design rule - but on most observations. Otherwise those 'smart' OEM's often loose out in the long run. Pssst - they'
Electronics Forum | Tue Dec 18 22:20:54 EST 2007 | darby
Paul, For the Dek and following equipment - seperate all the "bad fid" pcbs and process them seperately. Drill a hole as accurately as you can through the bad fids making sure you leave some white area around them. Set up and run a seperate program u
Electronics Forum | Wed Dec 12 19:37:52 EST 2007 | marcelll
On a old VIP 98 oven. Since we reload the software, we have a problem with the board tracking system. Board is flagging the entrance pcell, we can see it on the graphic screen, but alarming all the time when at exit end. Alarm is "board droped in ove
Electronics Forum | Tue Dec 18 06:04:23 EST 2007 | lococost
Ha! We do our tin analyis at Alpha and they don't list Ge (that doesnt mean they don't check it). Next time a German Dope head takes a tour in our factory, I'll try to push him in our solderpot and let you know if ze board get ze better wetting.
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Tue Jun 17 15:35:12 EDT 2008 | slthomas
But don't you need to control the rate of the drop in pressure? I'd think if you pull down quickly it just results in the same popcorning you'd see in a reflow oven. I just know it's not hard to boil water in a vacuum chamber. For that matter, it's
Electronics Forum | Mon Dec 24 19:12:06 EST 2007 | adamben10
I'm shadowing an old posting posted by Odor back in March 2002. Any Expert out there, if you have good answer to the below questions, please dive in...Thanks in advance. 1) Does anybody have done the profiling board life time experiment? 2) The prof
Electronics Forum | Wed Jan 16 12:18:35 EST 2008 | mscalzo3
We looked into the same issues last year, and we decided on a Koh Young 3020 (table-top) that is running Koh Young 3030 (In-line) software. Our decision was based on a 1-year research process that included data from both our customers that were usin
Electronics Forum | Tue Jan 08 18:24:32 EST 2008 | jmelson
If your wedding ring ever gets hot enough to melt solder, I sure hope your finger isn't in it at the time! On the original question, most stainless alloys have quite a bit of Nickel in them, so going to stainless will not ELIMINATE nickel, although