Electronics Forum: timely (Page 646 of 1077)

Re: Solder Paste Dispense problems

Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F

Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si

Re: Quantity of dross and type of flux

Electronics Forum | Tue Nov 21 22:15:59 EST 2000 | Vince Whipple

Mohammed, The first suggested place to start with your question would probably be with your flux Mfr. Push them! The quantity of dross is effected by several factors: The higher your solder pot temp., the higher your dross level... but don't go too

Re: Micro solder balling

Electronics Forum | Tue Oct 31 14:52:25 EST 2000 | Dr. Kantesh Doss

Hi Antonio: You clearly have printed excessive amount of solder paste on the pad. You can reduce the amount of paste by one or two methods: 1. Switchover to 5 mil thick stencils. 2. Change the design of your stencil openings (at the discrete compone

Re: Adhesive Dispenser Vs. Screen Printing Adhesives Pros and Cons

Electronics Forum | Tue Oct 03 20:35:23 EDT 2000 | Dave F

1. Throughput * Dispenser: Slower, may loose 70% of tact on fast chip shooters * Printer: Can be put in front of and use fast chip shooters effectively 2. Rework Rate ???? Deposition control???? * Dispenser - High control over amount paste - Coplan

Re: IPC Land Pattern Vs Manufacturer's Recommendation

Electronics Forum | Wed Sep 06 11:18:52 EDT 2000 | Chris May

Randy, I have been with my present company about 14 months and my first and ongoing task is to improve 1st time yield rates at ATE. Upon examination of the failures (14 months ago)there were cases of IC legs being physically wider than the pads on

Re: FAQs, archives, and the never-ending story

Electronics Forum | Thu Aug 24 12:35:30 EDT 2000 | Wolfgang Busko

The dilemma with this is that the search in the archive is often not that enlighting as someone might hope. Fact is that each new question (and the answers as well) on old topics adds to the archive making it not better. Well, and than look for the r

Re: The best way to erase flux from the golden fingers?

Electronics Forum | Mon Aug 21 20:17:08 EDT 2000 | Dave F

Hey Gyver: Oooow, using a pencil eraser has to take time. I would hate to be the person responding to your customer trying to explain the pencil eraser shreds accidentally left on the board. Awww, just spritz it with DI water and wipe it off with

Re: Barcoding Component Reels

Electronics Forum | Wed Aug 16 22:32:15 EDT 2000 | Dave F

John: It's easy to put parts in the wrong place!!! Isn't it? Starting at the beginning: check the part at incoming inspection ... measure the value upon receiving the part, if it's possible. Verify the marking on the part. Next: Prevent things f

Re: solder balling

Electronics Forum | Mon Aug 07 10:22:13 EDT 2000 | genglish

Ramon, I have had experience in the problems you are witnessing. The problem can relate to a number of factors. Obviously the printing process is the first place to start your investigations, try looking at the stencil apertures for bleed under the

Re: Clamshell printers

Electronics Forum | Fri Aug 04 12:57:34 EDT 2000 | Steve Thomas

James, we used to use 3 clamshell type printers (one of which did have a two camera vision system, and did all our fine pitch), but had limited success with 20 mil pitch. 25 mil pitch was no problem. I suspect that you'll find people that have had


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