Electronics Forum | Mon Feb 03 22:48:00 EST 2003 | vinesh
Hi all, We are using small CSPs (10x10mm) in one of our products which has a big ground pad in the center (7x7mm). The maximum voiding allowed on this big pad is also no greater than 25% which we are finding very hard to achieve. The centre pad ha
Electronics Forum | Mon Mar 03 05:35:21 EST 2003 | Kelly
We just had this issue a couple months ago with a single sided FR-4 board which was scored. We found that the design was a factor but also the depth of the v-score. Since then we have re-designed the part further away from the score line. At the same
Electronics Forum | Mon Feb 10 21:30:48 EST 2003 | MA/NY DDave
Hi You are probably right. The only thing I will tell you is that one time as thee DFM engineer working between many electronic designers, component manufacturers and CEMs (contract electronic manufacturers) the component manufacturer would not bud
Electronics Forum | Fri Feb 07 16:36:30 EST 2003 | jonfox
About as good as you are going to get for a general (broad) package download is from the two dummy component companies listed. If you want something better and corresponds to the parts that you are using (not dummy parts) download the data sheets fo
Electronics Forum | Tue Feb 11 09:31:10 EST 2003 | babe
I never could understand anyone investing lots of money on tile,epoxy or rubber flooring when they simply rent the building. If you own it, well thats a different story. The above esd products are expensive yet extremely durable. If your going to ren
Electronics Forum | Thu Feb 13 15:59:08 EST 2003 | genny
Yes Access is a definite option. We have an in-house built and tailored MRP package, that started out with Access and VB. I am not sure if it is still solely based on that or not. We have tailored it so much and worked with it so much that I doubt
Electronics Forum | Thu Feb 20 10:56:49 EST 2003 | larryk
Interesting topic, I got a side bar question. The epoxy companies suggest a lower consistant temp (something like 1 minute at 160 degrees) for curing. But we epoxy and paste our boards that get waved. (I know, why are ya pasting a board that goes t
Electronics Forum | Fri Feb 21 11:33:47 EST 2003 | Jaime
Call your glue manufacturer. It sounds to me that the epoxy is not curing properly. You should also test for shear strenght. How many pounds of pressure does it take to "pop" a cured component after it comes out of the oven? What type of oven do you
Electronics Forum | Mon Feb 24 10:21:29 EST 2003 | ryanm
Just an update on my problem. I spoke to Loctite and they had very few solutions. One thing they suggested to try was to add a thirty-second soak time at 150 degrees to my reflow profile. The problem with that is ramp-soak-spike profiles doesn�t s
Electronics Forum | Mon Feb 24 11:02:42 EST 2003 | Claude_Couture
Every time this problem was brought to me, handling was the problem. Make sure to: 1- track the exact place the components are lost, i.e.: visually inspect the pcb before and after each step in your assembly line. 2- if step one does not pin point t
