Electronics Forum | Thu Jul 27 12:20:33 EDT 2006 | David
Hello all, We have customer who wants to produce boards 0.4 mm thick. But they have not allowed to put into the panel. Board has not regular shape so without pallet it is not possible to produce. I made pallet where is pocket the same shape as boar
Electronics Forum | Thu Jul 27 22:49:18 EDT 2006 | chrispy1963
I am searching for any information concerning this type of SMT placement equipment. Currently our facility utilizes Panasonic CM202 inline with MyData MY12 machines for our production builds. Our managment has found a couple of the Siemens machines
Electronics Forum | Fri Aug 04 16:11:59 EDT 2006 | chrisgriffin
Hell Doc, This is an easy one. But first I must disagree with the wave master. I have done extensive refurb. jobs on Soltec and Vectra. The only thing Soltec has on Vectra is a better solder pot, and even that is close. Vectra software is many, m
Electronics Forum | Fri Aug 04 13:47:20 EDT 2006 | pemea1
apples to apples. 20 boards 80 parts top and 10 parts bottom. these boards are done on a semi regular basis (you know the boards are coming to you from an OEM at least three times a month, just no exact schedule). All that is required is pasting..mo
Electronics Forum | Fri Aug 04 15:46:08 EDT 2006 | Chunks
Two reasons company B is asking $40 instead of $15-$20; 1. The set-up of their placement equipment takes time, thus the extra labor. Parts may be hard to get or what they norm keep in stock, plus storage of parts. 2. They know they can get awa
Electronics Forum | Thu Aug 17 23:24:34 EDT 2006 | guest
I suggest you do the ff prior the machines arrival at your site. - Get all the dimensions of purchased machines from their catalogue. - Lay out / draw their footprints in the manufacturing floor. - Drop down air and power supply. Unpacking, level
Electronics Forum | Sun Aug 20 21:43:19 EDT 2006 | darby
Yes, I agree with guest. Lay it all out with masking tape on the floor. Include the width of feeders sticking out. Confirm the position of power, air, network and smema connections. You may even want to use cardboard layed out on to the floor. You ha
Electronics Forum | Mon Aug 14 18:03:49 EDT 2006 | GS
Sure the bake need to be done after BGA replacement? Normally the board need to be backed before BGA replacement (not only)in order to avoid PCB delamination due to moisture entrapped during his life staing on field. Oven Temperature from 90 to 125
Electronics Forum | Wed Aug 16 03:48:24 EDT 2006 | umar
Hi All SMT Net Team Member, I always have problem at MY SMT process and production side, Every time product running at my production side always found a lot solder Ball issue near the pad of SMT chip component. We had quite hard to do the trouble s
Electronics Forum | Fri Aug 18 00:23:21 EDT 2006 | umar
Hi SWAG/Rush/Steve, Thanks for your response, Currently I am running with 811 lead paste. Actually this problem not only effect for one assy. I got 700 models runing at my company, but almost 50% of the model I have problem with solder balls issue.