Industry Directory | Manufacturer
American Tin and Solder is smaller, family owned and opperated solder manufacturer. We offer leaded and lead free solder in many forms including: Bar, Paste, Wired(with or w/o a core), etc.
New Equipment | Solder Paste Stencils
Product material: stainless steel (internal) + steel plate baking paint Storage quantity: 36 cans of tin paste Product weight: 13kg Product size: 495 * 750 * 95mm Application: SMT workshop solder paste storage control, first in, first out
New Equipment | Assembly Services
G9 + automatic vision printing machine is a new product for SMT high-end application field, which can perfectly meet the process requirements of 03015, 0.25pich and other fine spacing, high precision and high speed. Introduction to standard function
Electronics Forum | Tue Aug 30 09:24:08 EDT 2005 | Slaine
we manufacture a range of ceramic parts that have silver termination,there is already a small leaching problem (absorption of the termination by the solder in liquid form)with Sn62 that we live with, having to implement unleaded solder they are norma
Electronics Forum | Wed Aug 09 08:06:07 EDT 2006 | davef
See "IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards" 3.2.1 Immersion Tin Thickness. The most common reason for solderability issues with the white tin surface coating during multiple thermal excursions is a thin white ti
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Used SMT Equipment | SMT Equipment
Product Name :Panasoinc NPM module Product number: two modules NPM Detailed product introduction 2D inspection head function of NPM tape coating machine: 1, NPM check head resolution: 9 m 2, NPM check head vision: 21.1 * 17.6mm 3, check proc
Industry News | 2023-06-12 21:14:11.0
The 2023 Beijing Intelligent Manufacturing and SMT Technology Exchange Conference, hosted by the Intelligent Manufacturing Committee of the Beijing Electronics Society, was successfully held in Beijing on May 25th. HELLER was honored to be invited and actively participated by sharing their cutting-edge technology and expertise.
Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Parts & Supplies | Other Equipment
Automtaic PCB Lead Cutter, Lead Cutting Machine FEATHERS The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t
Parts & Supplies | Other Equipment
Automtaic PCB Lead Cutter, Lead Cutting Machine FEATHERS The eagle claw shrapnel clamp can nip PC boards tightly and push them forward automatically and stably. The track board-delivery speed can be adjusted according to pins to increase t
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
Technical Library | 2019-06-20 07:45:19.0
One of the two basic risks of employing the commercially accepted, Restriction of Hazardous Substances (RoHS) compliant, lead-free (Pb-free) electronics is the threat to the electronics reliability from the growth of tin whiskers. The other basic risk deals with Pb-free solder joint reliability.
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce production cost, create a greener environment and assist the quality process. Use special stirring system to melt
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC/WHMA-A-620 Specialist (CIS)
The Certified IPC/WHMA-A-620 Specialist (CIS) training focuses on cable and wire harness fabrication and installation.
Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,
Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement
Events Calendar | Thu May 17 00:00:00 EDT 2018 - Fri May 18 00:00:00 EDT 2018 | ,
Tin Whisker - All You Should Know - SMTA Webtorial
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
SMTnet Express, August 1, 2019, Subscribers: 32,197, Companies: 10,845, Users: 24,998 Tin Whiskers: Risks with Lead Free | Part I Credits: ACI Technologies, Inc. Tin (Sn) metal displays the characteristic of growing "tin whiskers" from pure tin
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published
| https://www.eptac.com/faqs/ask-helena-leo/ask/problems-with-pcb-micro-voiding
7.5.3.5 on IMC Microvoids it states: “… IMC Microvoids occur within the Intermetallic Compound (IMC) formed between copper and high tin solders, including SAC and tin/lead solders
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
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