Electronics Forum | Mon Nov 19 17:40:38 EST 2007 | bbarton
No, the thicker plating and need for very high quality drilling and plating is DUE to the higher copper dissolution rate and higher contact time. As to the Sn100C material, their claims seem to confirm a "lower" copper dissolution rate, but so does A
Electronics Forum | Thu Feb 21 03:25:58 EST 2008 | jlawson
I have seen smt chip varistors with Pd/Ag teminations that had poor wetting in terms of good fillet in LF (sac305) soldering. We found that the solder tended to be attracted to the plating on the part and off the actual pad (silver Immersion). This c
Electronics Forum | Thu May 15 15:02:03 EDT 2008 | ccross
We have seen this problem before. We have ALWAYS found it to be a board vendor issue. Also, we tend to see it more during the summer months. Our solution has been to bake our PCBs @ 50 deg C for 1 hr prior to use. We use immersion white tin board fin
Electronics Forum | Tue Jul 15 16:30:57 EDT 2008 | boardhouse
Hi Aj, Recommended Immersion gold thickness would be 3-5 Micro inches over 140 -200 micro inches of Nickel. Thicker Immersion gold than 5 micro inches can cause solder joint embrittlement. Gold readily dissolves in molten solder and will be present
Electronics Forum | Thu Aug 07 10:02:10 EDT 2008 | eyalg
We are facing low quality due to soldering opens with coilcraft inductors 0402CS-2N7XGLW. The termination used is(suffix L =RoHS compliant silver-palladium-platinum-glass frit. Did anyone had this problem in the past? Can we do better using T = RoH
Electronics Forum | Thu Aug 07 11:58:36 EDT 2008 | pbarton
We have experienced the same problem with Pd/AG and P/Ag terminations on precision resistive parts. The problem is dissolution of the termination metallisation into the bulk solder. This is exacerbated by the higher thermal profiles required for RoHS
Electronics Forum | Wed Sep 03 19:54:23 EDT 2008 | vladig
Well, I'm not a sale person whatsoever. I'm a purely technical guy (even PhD :-)) who has been with the industry for quite a few years and I know very well what intermetallics means and how thck it should be for different board finishes and solders
Electronics Forum | Thu Oct 23 12:50:28 EDT 2008 | gregoryyork
Hi Dave sorry not been back the Tin/P regenerator is controlled amounts of Phos additive that metallurgically reduces the dross. We do not recommend chemical methods for dross reduction as many salts/chemicals used could be hygroscopic in nature and
Electronics Forum | Wed Nov 12 09:32:30 EST 2008 | markhoch
Are there better options? Dude, EVERYTHING else is a better option. Gluing aluminum foil down to the bare copper would be a better option. ENIG (Electroless Nickel Immersion Gold), Immersion Silver, Immersion Tin, and OSP all provide flatter surfac
Electronics Forum | Wed Feb 04 09:44:47 EST 2009 | lococost
It's not a silly arguement. I'm guessing you are talking about wavesoldering? Think about holefill, The reason tin will not fully fill difficult holes is the temperature at the top is too low, it is below the melting point. Increase this melting
