Electronics Forum | Thu Jun 19 20:03:33 EDT 2003 | davef
Most of the BIG board fabs give comparisons, like you seek, on their sites. For instance: http://www.merix.com/main_res.html We have no relationship nor receive benefit from the company referenced in the above link. Finally, consider immersion ti
Electronics Forum | Wed Jun 25 12:13:31 EDT 2003 | russ
A lot of it depends upon what the lead terminations are and the storage conditions. For example if they are tin you will run into trouble. We have used all types of parts that are all ages (We just started doing BGAs that are 5 years old.) I don't
Electronics Forum | Wed Aug 06 16:35:31 EDT 2003 | Carol
This is an old topic, but keeps coming up. Solderability and reliability issues with SMT gold plated terminations when used with tin/lead solder paste/hassle finish PWB. I need to know which standard (mil, IPC, J-STD??) tells you all about the probl
Electronics Forum | Thu Aug 07 16:52:49 EDT 2003 | craigj
We've been doing it for quite a while on some parts but are noticing that as more manufacturers are going lead free we are starting to see some issues. Particularily with pure tin on nickel. Have found that need to increase oven reflow temp and time
Electronics Forum | Thu Aug 14 15:46:35 EDT 2003 | dphilbrick
Although DaveF's answer was probably more applicable and there is some really good info on Tin Whiskers it doesn�t really answer the question either from what I saw. I suspect this will become a much larger issue as we all are weaned off of lead!
Electronics Forum | Thu Dec 18 23:44:53 EST 2003 | Dean
...don't expect high yields with hasl on that device. Yeah, you an do it. But not reliably. Also, factor in board warp, bump tolerance AND HASL variation....recipe for disaster. can your process toleate a selective gold on the one device? How ab
Electronics Forum | Fri Jan 02 14:04:56 EST 2004 | jjwhite
Has anyone had any experience with 60/40 Sn/Ni(300 u in.) over Ni(300 u in.)? If so, what kind of solder issues might exist with 63/37 Sn/Pb reflow? Is a different paste needed? Also, what is the benefit of using the same platings with a top plating
Electronics Forum | Thu Jan 22 08:48:42 EST 2004 | patrickbruneel
Kris, You will need to change your probes to "bite" into the surface twisting probes specialy designed for copper surfaces. The surface hardness of copper is a lot higher compared to tin. link to article from osp manufacturer (see page 5) http://www
Electronics Forum | Fri Apr 09 20:28:14 EDT 2004 | Ken
I have experience in this. My company offers Lead free SMT and Wave soldering. I have processed ImSn, ImAg, Enig, OSP in both smt and wave. Yes, silver leaching will occur. Yes, copper leaching will occur. High tin content solders disolve everyt
Electronics Forum | Thu Apr 15 11:15:30 EDT 2004 | patrickbruneel
Pure (red) copper oxide is green, its not a residue its just oxidation. In your case water and heat will accelerate the oxidation process of unplated or unprotected pure copper. The best way to avoid this from happening is use a socket with tin or n
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