Electronics Forum: today (Page 31 of 88)

BGA & PCB - solderability issue

Electronics Forum | Thu Aug 29 07:46:39 EDT 2002 | nifhail

Hello Experts We ran into problem today when one of the board that we assembled having problem at Test, BGA failure. The joints looks good but no continuity. When trying to remove the BGA, i found that the pad on the PCB is intact but black in colou

Wow! Changes...

Electronics Forum | Thu Oct 17 10:27:32 EDT 2002 | davef

This is for Pete. He's very busy today, trying to make money to feed the wife and kids. Why doesn't the new SMTnet "home" look like the old "home"? * New "home" has like three boxes that each go all the way across the page. * Old "home" had like si

Handling PCB assy's

Electronics Forum | Mon Nov 04 14:05:51 EST 2002 | cnoonan

This is what pisses me off in this industry today. It seems the operators are in charge of the whole process. Management and supervisors are too afraid of lawsuits to lay down the rules and enforce them. If your procedure states and I am sure ever

Temp/Humidity Recorders Coverage

Electronics Forum | Tue Jan 07 18:07:59 EST 2003 | davef

J-STD-001 prescribes acceptable temperature and humidity ranges for electronic assembly, but does not discuss required instrumentation, nor its accuracy nor coverage. We're unaware of another standard that requires such a thing. The standards of to

Ceramic capacitors cracking

Electronics Forum | Wed Feb 05 05:29:33 EST 2003 | Rajinder Sharma

If you are facing problem of craked capacitor only after breaking of the panel into individual PCB's, this may be due to stress being generated on the capacitors terminals. The stress may be due excess pressure being applied on the panel for breaking

SMT Process Training

Electronics Forum | Fri Feb 21 00:23:30 EST 2003 | Dreamsniper

Technology keeps changin' and you need to keep on upgradin'. Lucky are those who work in a company that acquires advance equipment and technology yearly or everytime they are available, they are called the trend setters. Training coupled with hands-o

PCB Bake

Electronics Forum | Wed Mar 05 10:59:04 EST 2003 | jfb2003

Currently, my company's applies a PCB bake (5 hours @ 125C) for all SMT PCB's prior to surface mount assembly. Many of us believe this is a non-value added activity, and have concluded it can be eliminated. With today's PCB process controls coupled

solder fillet peeling update....

Electronics Forum | Tue Jul 15 11:18:29 EDT 2003 | slthomas

It is an interesting situation....one that merits as much business philosophy analysis as technical analysis. I'll be getting my official 60 day notice today. Any criticism about our overseas suppliers (that were selected by sr. management w/o in

Selective BGA ball removal

Electronics Forum | Wed Oct 29 23:40:29 EST 2003 | ppcbs

We here at Precision PCB Services, Inc. Perform selective ball removal. We just completed a job today where we removed 4 balls, and then installed traces to dog-bone the pads at two locations on 30 BGA's. An eaisier and more cost effective solutio

Solvent for a stencil printer

Electronics Forum | Tue Feb 17 16:10:21 EST 2004 | pjc

Speedline MPM has recently completed a study on solvents that are available to use in stencil wiper solvent systems. Until now there has been a small number of solvents that have been deemed safe to use. This was due to the fact that a majority of th


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