Electronics Forum | Mon Sep 23 22:31:48 EDT 2002 | davef
Comments are: * It�s interesting, but not surprising that your time above liquidous varies around the sides of this component. * You are correct in thinking that it is better to reduce than to increase the temperature differences around the component
Electronics Forum | Wed Oct 30 02:37:58 EST 2002 | Dreamsniper
Hi Guys, I have a fine pitch QFP that I suspect of having a solderability (wetability) problem. The heel joint is 50%-75% of the lead thickness so it means that I passed the IPC Class 2 recommended criteria on the Heel. The toe has at least 25%-50% s
Electronics Forum | Tue Jun 07 16:19:58 EDT 2005 | davef
Q1) How to identify on good or bad ICs lead that could contribute to dewetting? A1) Distinguish between good or bad IC that could contribute to dewetting by testing for solderability, according to J-STD-002. Q2) What actions that must be taken in fa
Electronics Forum | Thu Oct 26 12:36:02 EDT 2000 | Sal
Guys! witnessing a problem i've never seen before.Manufacturing a mixed technology with HASL finish, BGA,QFP's,fuses etc..etc. I've profiled the product, but what i'm witnessing is really weird. I've got a 0.020" QFP which is at the edge of the board
Electronics Forum | Thu Mar 29 15:26:35 EST 2001 | johnw
measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi
Electronics Forum | Fri Apr 06 09:02:20 EDT 2001 | CAL
FYI- Toe Fillets have not been required per IPC 610b/c (they are nice to have though). Remember before Solder paste inspection equipment The Solder powder type/size, stencil type, and apertures are what defined volume. The need has not been until rec
Electronics Forum | Thu Jun 28 22:42:13 EDT 2001 | davef
I�m with Stefan � no booze, drugs, or chewing tobacco in the shop!!! [I�d like to ban facial make-up, but am still limping from the last time I tried.] Stefan, how are you going to get the P&P manufacturers to agree on a common nozzle design, when
Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker
Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under
Electronics Forum | Sun Oct 10 00:40:42 EDT 1999 | John
| I'm searching for a source for surface mount socket savers that accept a hand test socket (Yamaichi, Nepenthe etc...). Barring availibity of an SMT socket saver does anyone know a good technique for soldering socket savers into a .250" thick, 20+ l
