Electronics Forum | Tue Mar 18 11:51:24 EST 2003 | slthomas
I like this answer! Part geometry, part mass, land pattern, print accuracy, reflow profile, placment accuracy, and aperture shape all play a role. If you use a homeplate to reduce solder balling, have high profile/low mass parts AND place more to
Electronics Forum | Tue Mar 18 16:41:04 EST 2003 | russ
Here is what I have been finding lately. We switched to a 22mil square pad on 40 mil centers (from the IPC "75/25"). ALL OF OUR TOMBSTONES HAVE GONE AWAY! (at least for now) we did not change profiles, paste, or any other parameter. Obviously placem
Electronics Forum | Thu Mar 20 12:04:42 EST 2003 | Ren� Sandoval
Hello Garcia: For my experience in Tombstone problems I recommend you to check the next points: -Use Solder paste with 2% silver -Use 5 mils Th Stencil -In some machines , for 0402 or smaller componentes , you require an special holder for the feed
Electronics Forum | Fri May 16 15:45:00 EDT 2003 | swagner
If the only difference between the two products is the board supplier I believe thats where I would start, we had a similar problem like this two months ago and it turned out to be a faulty (thin) HASL layer which did not meet our print tolerance. T
Electronics Forum | Fri Sep 09 11:24:31 EDT 2005 | stepheniii
Talk to your paste supplier. The reps for a couple of pastes have been very helpfull on various problems. And I've seen pastes advertised as being good for reducing tombstoning. And they see lots of customers and therefore see lots of problems and
Electronics Forum | Tue Nov 28 11:12:48 EST 2006 | billwestiet
The ONLY (unlikely) cause I could think of is if you are pushing the component into the solder, ending up with more solder on one side than the other. Why do you think it is the volume of solder that is causing this? By the way, there are "low tomb
Electronics Forum | Wed Jul 25 11:16:34 EDT 2007 | lloyd
Hi Folks, I hope someone can help me, Is the homeplate stencil design (for reduced solder paste) the same for preventing solder balls as it is for reducing tombstones? i.e. the reduction of solder paste under the component termination. I'm trying to
Electronics Forum | Fri Aug 01 00:40:06 EDT 2008 | roc2x
thanks,my pad design is 24 x 23 mils and now I chnged my stencil to 24 x 20 mils ship inwrds to lower down my volume. My placement is and part data are ok. My reflow N2 is using 1000ppm, Actual is 700-800ppm I already prolonged my pre-heat butit only
Electronics Forum | Wed Apr 15 17:16:00 EDT 2009 | rmitchell
Hi, I am trying to reduce some 0402 cap tombstones. The main cause is the pad spacing is a little too far apart and the parts are as tall as they are wide .5mm I am stuck with the pad spacing for a while. All other parts are soldering well, even 0
Electronics Forum | Sat Sep 27 13:12:37 EDT 2014 | gascon5383
I have a situation and was hoping to get some opinions on whether a saddle type profile is better or worse than a linear profile. We have an 8 heating zone 3 peak zone and 4 cooling zone single track oven that I am having a tombstone issue with. It's