Electronics Forum | Fri Apr 12 07:40:50 EDT 2019 | krob
We have found that our wave solder will produce worse hole fill/top side fillets nearest the conveyor, on most boards. I believe this is due in part to the smaller contact patches near the conveyor fingers. What could cause this reduced contact
Electronics Forum | Mon Jul 01 09:33:08 EDT 2019 | dbuschel
if you can't change the PCB materials or design at this point, you might be able to reduce it somewhat through the use of fixtures or edge stiffeners. Unless it is a particularly thick board, I don't think the reflow profile would be the issue. The t
Electronics Forum | Thu May 30 18:30:21 EDT 2019 | slthomas
Dave, if you single out "Simplematic" under used SMT equipment you get one where it looks like someone pasted an image of their product (with their URL, http://www.amikon.cn) on top of the actual paid advertiser's image. I didn't see amikon under the
Electronics Forum | Thu Jun 06 09:03:48 EDT 2019 | bobpan
If the part is 10mm or less as long as you are scanning it near the top...it should work. The other possible problem is dirt on the quadalign lens. Clean off the lens and watch it when it homes....both heads should home the same way. If the head jum
Electronics Forum | Mon Jul 01 04:58:50 EDT 2019 | SMTA-David
Hi, I have been looking around for an 8 zone reflow oven with convection heating top and bottom and computer control for setting up and storing profiles. The Chinese company "Jaguar" have a couple of models at reasonable price that look like they wo
Electronics Forum | Tue Dec 22 15:10:57 EST 2020 | ilavu
Tom, There are two power supply in the machine. One on top of VME box and other behind power distribution panel. The voltage that you see and check at PDP is not from VME.
Electronics Forum | Fri Nov 22 16:59:43 EST 2019 | dwl
I'm worried about the voids that you have on the heel fillet of the leads. Off the top of my head, I don't recall if/what the IPC spec is for voids in gull lead fillets is but my gut instinct is that you're compromising the mechanical strength of the
Electronics Forum | Fri Nov 22 05:04:07 EST 2019 | SMTA-Matthew
We have some circuit boards where the solder mask seems clear instead of green on top of some of the tented via pads. No gold deposited during the ENiG process and no solder sticks to it but why is it clear and does it have any correlation to the thi
Electronics Forum | Mon Dec 09 21:00:39 EST 2019 | sssamw
Did you solve this issue? It doesn't much look like the flux dried out, ti should be across whole board and has much more same defect if flux dried out. Did you have failure ratio data to show the defect location, for example 10% at location A on bo
Electronics Forum | Tue Jan 21 16:11:05 EST 2020 | dgiordano
3.3.5.1 HIC Placement states "The HIC may be placed anywhere in the MBB, but should not be placed under, on top or touching a desiccant pouch." How do you assure that the HIC doesn't touch the desiccant pouch? Do you secure the HIC to the reel or to
