Electronics Forum | Mon Feb 05 06:57:52 EST 2001 | PeteC
Dason, IPC/EIA J-STD-001C states: "....temperature within the range of 230C (446F) to 290C (554C)." That's a pretty wide process range. 250C has been typical in the past. We run ours from 230C to 240C. We have found that some single-sided PCBs can de
Electronics Forum | Wed Feb 14 21:14:45 EST 2001 | davef
BGA Shorting 1 Damaged mask in between the BGA pad and via on the substrate. 2 Poor print registration. 3 Poor via segregation from the pads? Are they tented or is there just a dam in between? 4 Review the profile. You can run into a number of p
Electronics Forum | Thu Feb 15 19:44:50 EST 2001 | davef
I assume Roland [er someone like that] explained on the Main Conference also known as the Forum, the blue "New Thread" button near the middle of the page and 1 1/2" in from the right margin as the preferred way for posting a new thread. [Well, if th
Electronics Forum | Thu Feb 15 19:41:38 EST 2001 | davef
What do you mean by "But after performing temperature cycle test, the former aging rate (from the shear strength ) seems faster than the latter."? Comments are: I can't recall having heard the term "precipitation hardness" [not that that means anyt
Electronics Forum | Thu Mar 01 10:46:11 EST 2001 | davef
Various lint free stencil wipe suppliers take various approaches to stencil cleaning. For instance ... Techspray Directions: Start with a dry TechClean Wipe (2358, 2361, or 2362) to remove excess solder pastes. Follow this with the 1608 Pre-Saturat
Electronics Forum | Wed Mar 14 18:17:40 EST 2001 | mparker
Some thing to watch out for is the cure spec for the adhesive. Will that match with your solder paste reflow spec? You will have two dissimiliar materials going through endothermic reactions at the same time. You could end up with under cured adhesiv
Electronics Forum | Fri Mar 16 09:18:52 EST 2001 | pteerink
just gotta put in my two cents worth...... theories are great, and I do not disagreee that almost all root causes can be traced back to human error. ( just an aside, but it would be a little hard for me to get ahold of the production guy somewhere
Electronics Forum | Thu Mar 22 13:41:41 EST 2001 | mparker
What's the reality of the situation? Are you creating a specmanship issue here just to satisfy Class 3? Can you demonstrate that the paste volume applied to the plastic QFP's give sufficient overall fillets for mechanical and electrical properties? W
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL
With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including
