Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef
You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the
Electronics Forum | Mon Aug 19 13:16:15 EDT 2002 | kenbliss
Some things to consider 1. can one operator keep up with manual operations and not slow the line down? If yes, great. If no you will need a way to allow more than one operator access to the next board coming down the line to not create a bottleneck.
Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF
This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold
Electronics Forum | Tue Sep 24 11:10:07 EDT 2002 | Gregg Temkin
I�d appreciate assistance in trying to resolve a placement/soldering problem. My company has designed a board which uses a large number of 0402 LED�s that are .028� high. The LED�s need to be soldered so that they point straight up and are not til
Electronics Forum | Tue Oct 01 16:19:35 EDT 2002 | dragonslayr
Hello all- I am am seeking information to the top 100 BGA grid patterns. I am planning to have a full sheet of stencil foil populated with these most common types. I will cut out the individual grid patterns and create my own mini stencils. In a 27
Electronics Forum | Wed Oct 02 09:36:10 EDT 2002 | scottefiske
Dragon, Was recently responsible for No Clean Process/Material evaluation and implementation project. Shop was 100% Water soluble facility. Several Top Paste manufacturers were invited to participate. (3) were evaluated. All key variables were identi
Electronics Forum | Wed Oct 09 11:59:56 EDT 2002 | slthomas
Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particularly one that focuses on different processes? I'm being asked to produce information from said
Electronics Forum | Wed Oct 09 14:15:56 EDT 2002 | slthomas
Pardon the cross-post from the design board....I thought maybe I should query both populations. Is anyone out there aware of any standard or even a section of a standard that specifically addresses design guidelines for two-sided assemblies, particu
Electronics Forum | Wed Nov 06 15:47:49 EST 2002 | bpan
Hello All, Having a problem during reflow and would like your opinions. We are using Kester r562 water soluble paste and I am using a Kic 2000 profiler in a 4 zone oven (top only). We are seeing poor wetting or fillets that are not "passable" per IPC
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
