Electronics Forum: top (Page 286 of 311)

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef

We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats

High Mix/Low Volume Part Kitting

Electronics Forum | Tue Aug 23 20:46:41 EDT 2005 | darby

If I had my way - the person checking the incoming kit should be able to at least run, troubleshoot and preferably programme the SMT line. In fact they should be an expert.They have the paper work in front of them for that job. If the tape is cut - t

Gold Surface Finish on PCB's

Electronics Forum | Wed Dec 14 07:34:33 EST 2005 | davef

Mike Ozzy If I came to your house, I wouldn't punch you. I'd make you buy me beer. Vern Solberg; Tessera Technologies Inc., 3099 Orchard Dr, San Jose, CA 95134; 408 568 3734 F408 894 0768 vsolberg at tessera dot com. If that doesn't work try: Tes

CP6 Maintenance

Electronics Forum | Thu Mar 30 12:13:10 EST 2006 | Tech

Obviously you are not as experienced as you think so I will help you out a bit.You are correct on the size of the wrench. I was trying to recall from memory but the wrench size is 8mm. The odd size I recalled came from the other side of the wrench th

Raw PCB packaging

Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef

Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E

Via holes and Wave Solder

Electronics Forum | Mon Mar 13 14:26:45 EST 2006 | Wave Master Larry

Well, im not sure what plane you guys are on, but I can back up my what im talking about. Ya see I wnet to Soltec traingin back in 1995 for our new wave. I got a diploma proofing that I know what i'm talking about. no one else in my company has on

Palladium poor wetting

Electronics Forum | Tue May 23 21:14:22 EDT 2006 | davef

First, where the temperatures that aare mentioned in the original post measured? Second, it sounds like the PdAg component terminations are not seeing enough heat [your soldering iron touch-up proves this]. Your 232*C peak is the absolute minimum s

Can you wave solder this part

Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef

National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun

The story so far!

Electronics Forum | Wed Feb 28 14:22:53 EST 2007 | samir

Hey Patrick, have you heard the latest on Al Gore? How typical and this doesn't include all the times Gore flies on private jets adding even more CO2 to the atmosphere. Can anyone say HYPOCRITE. "Al Gore�s Personal Energy Use Is His Own "Incon

BGA Tilt

Electronics Forum | Fri Feb 09 11:48:09 EST 2007 | realchunks

0.25mm tilt? That's pretty small depending on you BGA size. Is it failing? Or just your Q.E. being anal? What size BGA we talking about? What ball count? Just one board? Maybe cheaper to just repair. Now assuming there is NO part under the BGA


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