Electronics Forum | Wed Jun 23 10:33:02 EDT 1999 | David Reese
We are reflowing boards that have glop top components mounted on them. Do glop tops have the same moisture sensitivity as fine pitch? Should we be baking the boards prior to reflow?
Electronics Forum | Wed Jul 04 10:08:23 EDT 2012 | daxman
I would agree with innova's suggestion of Marantz. I've seen 3 different AOI machines implemented into our shop, and you really have to consider the ease of use, and possibility of defects that operators can introduce. AOI's, theoretically, look good
Electronics Forum | Tue Feb 27 15:20:03 EST 2007 | slthomas
Put 'em all on one side unless you have a reason to split them up.
Electronics Forum | Thu Mar 01 10:35:06 EST 2012 | duso02
For that low a volume it would be simplest and most economical to just out source the work. If you want, just send me an e-mail and I can give you specific options on what would be best for you., in-house or out-house.
Electronics Forum | Wed Nov 15 11:00:35 EST 2000 | Finepitch Services
"depending on your pad design"... To me, Wolfgang gave you the biggest secret... I guess he meant the real pad width you get on your board is the start point. Get the average measurement in mils and then cut it from the sides at the percentages he h
Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076
https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting
Electronics Forum | Tue Nov 06 10:24:30 EST 2018 | davef
Standards Organisations, Electronics Technology & Manufacturing: • International Printed Circuits (IPC) • Semiconductor Materials & Equipment International (SEMI) • International Electrotechnical Commission (IECQ-CECC) • British Standards Institute (
Electronics Forum | Tue Nov 06 10:28:58 EST 2018 | davef
Media Links IPC Global Insight This weekly electronic newsletter includes IPC news and multimedia information on manufacturing and management best practices and solutions, new technologies, standards, government relations and environment, health and
Electronics Forum | Fri Oct 26 07:55:49 EDT 2001 | Kenny
Does anybody know how I work out how heavy a part I can have on the bottom side of the board while reflowing top. Obviously there is a tie between the footprint in the paste and the surface tension of solder paste, but what is it ?
Electronics Forum | Tue Aug 13 10:48:17 EDT 2019 | sankarseptember
We are facing ROHM Resistor stick to top peel off tape during feeder movement. What are the possible causes and how to prevent this issue?
