Electronics Forum: touch (Page 76 of 98)

Re: Serious stuff

Electronics Forum | Wed Aug 18 21:20:45 EDT 1999 | Dave F

| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop

Re: Serious stuff

Electronics Forum | Thu Aug 19 04:42:50 EDT 1999 | Earl Moon

| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t

Re: Serious stuff

Electronics Forum | Thu Aug 19 12:14:22 EDT 1999 | Doug Nebel

| OK folks, let's get real serious. | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | Anyway, I said it would take another 4 weeks to develop

Re: Reflow oven for solder side components??

Electronics Forum | Wed Aug 11 15:58:39 EDT 1999 | Doug Philbrick

| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or

Re: Is baking PCB necessary before solder process?

Electronics Forum | Thu Jul 29 00:23:45 EDT 1999 | ScottM

| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: Popcorn @ reflow

Electronics Forum | Thu May 20 18:08:57 EDT 1999 | DEON NUNGARAY

| hello...can somebody help me regarding the POPCORN at Reflow. What is this POPCORN at reflow, what it looks like, its cause and corrective action if there is... | | your help is greatly appreciated...thanks | | omat marasigan | Deon Response:|

Re: Hand-Solder Pre-Heat

Electronics Forum | Fri May 07 02:37:31 EDT 1999 | Bob Willis

| Mornin! | | We just had vendor in here pitching a "low-temperature rework system" which was intriguing, but too expensive. He did get me to thinking though, beyond heating ceramic caps before hand-soldering them, it seems like it would be ad

Re: Intrusive soldering

Electronics Forum | Tue Mar 23 04:07:44 EST 1999 | Scott Davies

Rob, We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. - Apply adhesive dots to selected

Re: Intrusive soldering

Electronics Forum | Thu Mar 25 14:00:45 EST 1999 | Bob Willis

| Rob, | | We are also using intrusive reflow to simultaneously process SMT and Thru-hole components. Our arrangement goes as follows: | | - Screen print solder paste to the single sided PCB using 0.008" laser cut stencil. | - Apply adhesive dots


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