Electronics Forum | Mon Apr 28 04:18:44 EDT 2003 | chrissieneale
I think i am just going to try and rework this one board. As you can well imagine we are going to have some interesting meetings trying to get the customer to accept it. The other boards actually have replacements (of the ones that have failed, and p
Electronics Forum | Thu May 06 19:13:24 EDT 2004 | Greg York
Watch your dwell time especially if larger components. Problem is normally associated with lower temp as well as insufficient flux coverage with larger massed boards or ground planes. Try to hand spray a board to check that fluxer operation is OK. If
Electronics Forum | Wed May 12 12:11:54 EDT 2004 | solderpro
Bruce, regards to all who are trying to help and have great input, with those type of lead length, I would be very impressed to see you get rid of the problem, and as the others said, no clean in a foam fluxer, not good but workable.... the real issu
Electronics Forum | Mon Dec 01 12:33:20 EST 2003 | frank
I see where I went wrong. The numbers provided by "Process Engineer" are correct. My company is trying to adhere to the Six Sigma code of business and the managament here falsely assumed that all of our equipment can do that as well. After doubl
Electronics Forum | Thu Mar 04 15:34:55 EST 2004 | adlsmt
I agree with above but would like to add: 1. You may want to try something like Bioact SC-10 wipes to clean your stencils. If what your using works good stick with it. Ultrasonic cleaners are expensive, take up room and my experience has not been go
Electronics Forum | Thu Apr 15 11:56:42 EDT 2004 | patrickbruneel
I would try a PTFE (Teflon) wire or Teflon protected wire or you could try anodized aluminum. Its getting more and more interesting how the lead free era develops. Just a thought I wander how long its going to take the tin (not passivated with lead)
Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry
Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which
Electronics Forum | Wed Jun 02 05:40:35 EDT 2004 | johnwnz
Is there not an issue with reflowign the SAC ball's in term's of drivign up the lead contect in a lead free joint that increases the risk of failure in them? certainly dramatically increases voiding... have some pictures of soem that a customer tried
Electronics Forum | Fri May 21 09:24:00 EDT 2004 | stefwitt
I guess, you tried already to change the color to black. In-Out, is this a submenu for I/O, or do you find numbers in there from 0 to 244? If so, than this may be the color transformation menu. If you find two columns, then the higher number should b
Electronics Forum | Tue Jun 15 17:36:32 EDT 2004 | johnthor
I don't recall if a specific alloy was mentioned just that most lead free alloys would not melt with a Pb profile and result in a less reliable joint in the long term. There was also concern about tin whiskers. Try the archives at http://www.ipc.or
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