Electronics Forum | Thu Mar 27 12:58:03 EST 2003 | Mike Cyr
More to the point, If Ross follows this link, he will be able to locate the part he is trying to insert. http://www.uic.com/ss/uictrack.nsf/home?openform
Electronics Forum | Wed Sep 30 12:11:56 EDT 1998 | Claudine Hanson
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Wed Sep 30 10:54:31 EDT 1998 | Clifford Peaslee
Very unusual. It seems to work on some pages, and not on others. I will do some research to try and correct that problem. Cliff
Electronics Forum | Fri Sep 25 22:39:04 EDT 1998 | Brandon Nemen
Greg, Here's a few more you may want to try out... 1. AssemblyNet (www.assemblynet.com) 2. Chipshooters.Com (www.chipshooters.com) Hope it helps. | Anyone have any good links about electronics manufacturing process such as Throughhole Technology or S
Electronics Forum | Mon Sep 14 04:36:53 EDT 1998 | Frank Ferdinandi
I am trying to find out if it is possible to wavesolder TSOP's. If so , what should the footprint be like, and how should the wavesolder process be set up ? Alternatively can PLCC's be wavesoldered ? I would greatly appreciate any help. Regards Fran
Electronics Forum | Wed Feb 24 07:44:22 EST 1999 | Joe Cameron
How is CPk determined by glass slugs and plates? Can someone explain the process, please? If it's feasible, I'm willing to try it out, also. Thanks, Joe
Electronics Forum | Tue Sep 01 17:19:42 EDT 1998 | Eric Cox
I tried but could not e-mail you. The book sounds real interesting. We would like to include it in our First Chapter Bookstore. If you are intersted, please take a look at our Bookstore via the following link and contact me for details. Thanks, Cu
Electronics Forum | Fri Jul 31 17:21:38 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:23:11 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
Electronics Forum | Fri Jul 31 17:24:12 EDT 1998 | MMurphy
31 mil pitch components go either 1:1 or reduce 1 mil per side (you can reduce further if the foil thickness is > 7 mil.), you may want to try an oval shape here also.
