Electronics Forum: tri (Page 561 of 941)

Who is responsible for backing up programs on machines?

Electronics Forum | Fri Jan 05 13:15:59 EST 2007 | jhaviland

Depends on your company's IT policies. I have seen some companies where IT will not touch a production PC since it was not a standard IT issue PC, I have also seen some companies IT department do normal backups of the machines. (personally) whoever c

Problem with shielding component

Electronics Forum | Tue Jan 09 13:01:17 EST 2007 | stepheniii

Not unless it's a case of "the only difference is..." What I mean by that is more than once I've been told the only difference in a new rev is one component or one change. But the truth was that was the only reason for the change, and in fact there

SMT machine shift to China

Electronics Forum | Thu Jan 11 18:16:40 EST 2007 | slthomas

I won't even guess, but I would suggest that if you don't get much help here (pretty tough question), you might try dogging somebody at IPC. They seem to have a pretty good handle on that kind of stuff. All I know for sure is that we shipped a worki

Axis head 2 z velocity error

Electronics Forum | Mon Jan 15 11:12:08 EST 2007 | jaimebc

I've had experienced this issues here with our GSM's Flex heads. Try this: 1.- Clean your linear scales with alcohol and a lint free cloth. Both the X and Y. This one has fixed the majority of our errors when one of the heads just stops for no apare

Wave soldering problem - strange colour of the solder

Electronics Forum | Tue Jan 16 18:18:46 EST 2007 | greg york

Sorry that answer never really gave you the reason and ways to resolve. Reason - most composite pallets are only good up to 180C so thermal excursions at 250 or even 270c lead free kill them. Try to stay on top of cleaning as well and some pallet mat

Lead free rework of BGA

Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39

When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.

AOI: �SAKI, OMRON, MODUS,MIRTEC...?

Electronics Forum | Thu Jan 18 05:35:22 EST 2007 | joseluis_amper

Dear friends, I'm from Spain and, in this moment, we try to decide what AOI we need. We had in floor, in Demo, the SAKI, and it was good. But we want to test more machines, and I heard about Omron, Modus, Mirtec.....We have a litle production but so

APEX Venue!!

Electronics Forum | Tue Mar 06 12:58:05 EST 2007 | gregp

Hmmmm, Chicago in February or southern Cal? If I'm getting on a plane anyway I'll go the extra few hours. The show was actually very good for us. We don't look at overall show attendance we look at number of quality leads (which there were many).

Pump Stencil

Electronics Forum | Fri Jan 19 07:54:56 EST 2007 | realchunks

I believe you are describing a pin in paste process. Not sure where a stencil is involved. Depending on you machine/pump, you can do damage to it by running paste thru it. Paste is a metal and will wear out internal parts. Also, most pastes used

UP2000 with grid-lok question

Electronics Forum | Tue Jan 23 17:32:53 EST 2007 | russ

if you cannot spend any money I would say that you either need to add rails or try to increase the squeegee pressure to hold down the stencil while it prints those close pads. But...... Can you put PCB onto some type of carrier that would move thes


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